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Welcome to the SEMI Quarterly Report to Members | |||||||||||||||||||||||||
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Quarter 2 (April 1-June 30) Global SEMI Accomplishments SEMI Foundation and High Tech U In Grenoble, STMicroelectronics and Soitec delivered their seventh High Tech U (HTU) program. The SEMI Foundation licensed Soitec and STMicroelectronics to deliver HTU programs in 2009. In the U.S., HTU events were held in: Washington with support from Lower Columbia College and Columbia Analytical Services; New York (which included a tour of the GlobalFoundries ITDC lab), an event supported by Quad/Graphics and TEC-SMART; and Arizona, supported by the Fab Owners Association with ON Semiconductor and EV Group hosting the students and providing scholarships for two students. In other news, Norm Armour, VP and GM at GLOBALFOUNDRIES in Malta, New York, received recognition at AMSC for his continued support of the SEMI Foundation since its inception. | |||||||||||||||||||||||||
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Quarter 2 (April 1-June 30) Semiconductor BU Accomplishments SEMICON Singapore 2011 SEMICON Singapore 2011 was held May 11-13 with more than 6,600 verified visitors (6.3% increase over 2010) with 141 companies exhibiting. A highlight of the exhibition was the COO Series co-chaired by Rodney Morgan, executive officer of IM Flash Technologies, with executive speakers from UMC, Infineon, ASML, Applied Materials and more. SEMICON Russia 2011 SEMICON Russia 2011 was held May 31-June 2 in Moscow and was co-located with SOLARCON Russia for the first time. Total verified attendance was 2,028 (a 4.3% increase over 2010) with 20 countries represented. 105 exhibitors participated in the event which had more than 60 program and session speakers. SEMI/IEEE Advanced Semiconductor Manufacturing Conference 2011 A successful SEMI/IEEE Advanced Semiconductor Manufacturing Conference (ASMC) was held in May 2011 in Saratoga Springs, NY. The conference featured over 60 technical presentations, as well as keynotes by GLOBALFOUNDRIES, IBM and Tradition Equities. Market Trends Addressed in SEMI Northeast Forum Speakers from Gartner, IC Insights and Semico Research provided over 70 attendees of the SEMI Northeast Forum with a market trend update on June 1. The event was hosted by Brooks Automation in Chelmsford, MA. Tutorial: Semiconductor Processing Technology, Packaging Technology SEMI Korea delivered two tutorials about Semiconductor Processing Technology (SPT) and Packaging Technology in Q2. SPT had a record 211 attendees with two courses (basic/intermediate). The Packaging Tutorial was held in cooperation with Kangnam University, with 110 attendees. Both tutorials are annual events which will be expanded next year. 450 mm Wafer Standard SEMI E159-0611, Mechanical Specification for Multi Application Carrier (MAC) Used to Transport and Ship 450 mm Wafers was published. A total of seven 450 mm-related standards have now been published. These standards were developed by the Physical Interfaces & Carriers Committee, the Silicon Wafer Committee, and the Assembly & Packaging Committee. 3D Stacked IC (3DS-IC) Committee The 3D Stacked IC (3DS-IC) Committee started work on five new activities, including parameters for bonded wafer stacks, identification and marking of bonded wafer stacks, transport and storage containers for thin wafers, measuring voids in bonded wafer stacks, and terminology for measured geometrical parameters of through-silicon-vias. 5th SEMI Brussels Forum The Brussels Forum, the leading policy event for the European semiconductor and PV equipment and materials industries, took place in April. Industry leaders and EU representatives discussed practical recommendations on some of Europe‘s Key Enabling Technologies (KETs), addressing the needs of the European semiconductor and PV industries. Two hundred participants from 29 countries were in attendance, with more than half representing the EC, European Parliament, officials from Regions, and other associations. Many attendees weighed in on the issues including: Dirk Stenkamp (Centrotherm), Rutger Wijburg (NXP Semiconductors), Neelie Kroes (European Commissioner for Climate Change), and Eicke Weber (Fraunhofer). Industry Executives Flock to Capitol Hill The annual Washington Forum event took place this year on April 6. This year, over 25 industry executives traveled to Washington D.C. for government meetings. Forum participants focused their lobbying efforts on promoting R&D in the U.S. Executives met with over two dozen policymakers in Congress and the White House and presented the annual SEMI Government Leadership Award to Congressman Michael McCaul (R-TX) for his efforts to advance innovation in America. SEMI Meeting with U.S. Intellectual Property Czar In April, SEMI and the Semiconductor Industry Association organized a meeting with Silicon Valley member companies and Victoria Espinel, the U.S. Intellectual Property (IP) Enforcement Coordinator in the Office of the President. SEMI communicated member concerns about international IP protection. SEMI Promotes Trade Compliance in China SEMI hosted over 50 trade compliance experts at a Shanghai seminar on June 8. This educational and networking event is part of a series of programs organized with partner associations TechAmerica and USITO to promote international trade. The featured speaker was Larry Panigot, the Commerce Department's new export control officer for China, who serves a vital role with responsibility for conducting pre-license checks and end-use verification visits that are often necessary for U.S. exporters to ship high-tech goods to China. The next program is scheduled for October in Beijing. SEMI Pushing for Global Tariff Reduction SEMI is working to eliminate tariffs on semiconductor equipment and materials. We are part of a group of more than 40 industry associations around the world who are urging governments to launch negotiations to expand the product scope of the Information Technology Agreement (ITA). Since the ITA product list has not been expanded since 1996, SEMI has prepared an elimination of tariff "wish list" of products. SEMI Industry Research and Statistics
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Quarter 2 (April 1-June 30) Photovoltaics BU Accomplishments SEMI PV Group/VDMA Release PV Manufacturing Equipment Book-to-Bill Report SEMI and VDMA (Verband Deutscher Maschinen- und Anlagenbau), the German Engineering Federation, released their new quarterly Worldwide Photovoltaics (PV) Equipment Market Statistics report. It is the industry's only book-to-bill report based on direct inputs from PV equipment manufacturers around the world. The Worldwide PV Equipment Market Statistics report is jointly produced by SEMI and VDMA. SEMI Publishes New PV Standard for Silicon Feedstock SEMI announced a new standard to specify silicon feedstock for photovoltaic (PV) manufacturing. SEMI PV17-0611 covers virgin silicon feedstock materials produced by chemical vapor deposition (CVD) processes, metallurgical refining processes, or other processes. This was a major effort, with contributions from major silicon suppliers from around the world. Intersolar Europe 2011: Where PV Meets Manufacturing The 7th Advanced PV Manufacturing Forum for Crysalline Silicon Technology took place on June 7. The sessions featured a close look at the most critical hurdles identified by the early PV Technology Roadmap and how to take on the challenges to continuously advance PV manufacturing tools and operation for a prosperous PV industry in the long-term. In addition to the PV forum, the leaders in PV Production and Technology convened at Intersolar Europe with eight of the world's top ten equipment manufacturers exhibiting. In total, more than 230 of the world‘s leading PV equipment and materials suppliers gathered to showcase technical innovations and their latest products. Specification Proposal for Anti-Reflective Coating Glass A proposal to start the development of a specification for anti-reflective (AR) coating glass used in crystalline silicon PV modules was initiated. The proposal, from Suntech, is the first SEMI Standards development proposal ever issued from a Chinese company. It was approved by the North America PV Committee during their Spring 2011 meeting. (Efforts are underway to create a SEMI PV Standards Committee in China, but this initial activity will officially fall under the NA PV Committee.) China PV Policy Roadmap The SEMI PV Group released "China's Solar Future: A Recommended China PV Policy Roadmap 2.0," a report containing specific recommendations for a China PV policy roadmap. The report -- prepared by SEMI PV Group, the SEMI China PV Advisory Committee, and the China PV Industry Alliance (CPIA) -- recommends that, using the IEA Solar PV Roadmap as a benchmark, China should reach a global average PV electricity penetration level of 1.3% PV electricity by 2020, and 4.6% PV electricity by 2030. SEMI India PV Advisory Committee Tackles NSM Challenges In June, SEMI announced the expansion of the SEMI India PV Advisory Committee to include representatives from AES Solar Energy; Department of Energy Science and Engineering, Indian Institute of Technology Bombay; Siemens; SunEdison Energy India and Websol Energy Solutions. SEMI India PV Advisory Committee priorities for 2011 include raising the visibility of the solar industry in India through workforce development and industry collaboration, as well as identifying concrete ways of supporting the timely implementation of the National Solar Mission. Photovoltaic Tutorial in Korea With specialized curriculum and hands-on simulation, a photovoltaic tutorial was held in Korea University from June 10 to 14. The tutorial was based on real-life applications in the industry and hosted engineers in local companies. Co-organized with Korea University, there were 143 attendees. U.S. Energy Department Selects SEMI PV Group as Program Partner On April 5, the SEMI PV Group was selected to be part of the U.S. Department of Energy PV Manufacturing Initiative (PVMI), a $112 million government initiative to strengthen domestic PV manufacturing. SEMI is a partner in two of the three consortia. The largest of these awards is for $62.5 million with SEMATECH and the College of Nanoscience and Engineering (CSNE), which will concentrate on bringing CIGS-based thin-film technologies to market, and is known as the Photovoltaic Manufacturing Consortium (PVMC). SVTC Technologies, which received a grant of $25 million, is the other consortium that SEMI is involved with. This consortium will concentrate on developing technological improvements to drive down costs associated with crystalline silicon technologies. SEMI NA Promotes Solar in a Proposed Clean Energy Standard On April 11, the PV Group, under the guidance of the North America public policy subcommittee, submitted comments to the U.S. Senate Energy and Natural Resources Committee regarding the specific needs and challenges in implementing a nationwide Clean Energy Standard (CES). Committee Chairman Jeff Bingaman (D-NM) along with Ranking Member Lisa Murkowski (R-AK) released a white paper in March to solicit input from stakeholders. The PV Group supports a CES only if it includes a fair treatment of solar energy. With the current paradigm of federal subsidies, conventional fuels like coal and oil still receive vastly more federal support than the renewables. | |||||||||||||||||||||||||
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Quarter 2 (April 1-June 30) Emerging Markets BU Accomplishments SEMICON Russia 2011 Focuses in on Emerging Markets SEMICON Russia's TechARENA had several sessions on LEDs, including a Veeco presentation on "MOCVD Concept Enhancements" and Intech on "New Equipment for LED Manufacturing." In addition, Applied Materials presented on "Next Generation MEMS Manufacturing." SEMICON Singapore Puts Spotlight on MEMS and LEDs SEMICON Singapore took place May 11-13 and drew 6,621 verified visitors (an increase of 6.6% over 2010) and 141 exhibitors. The exposition featured a MEMS International Forum and an LED TechXPOT. SEMI Starts Work on Developing a Standard for 150 mm Sapphire Wafers The SEMI HB-LED Wafer Task Force is developing a specification for 150 mm diameter sapphire wafers for HB-LED applications. SEMI Draft Document 5265 will define the physical geometry of 150 mm sapphire wafers used in HB-LED manufacturing, including: wafer diameter, thickness, bow/warp, edge shape, ID marking, etc. SEMI Opto/LED Fab Forecast Records Explosive Growth Last year, SEMI recorded explosive growth on equipment spending from LED fabs, jumping from $606 million in 2009 to $1.78 billion in 2010. SEMI expects that LED equipment growth will continue this year to reach about $2.5 billion, a 40 percent increase year-over-year. If some projects do not ramp up as quickly as planned, then some spending will be pushed to 2012. Currently, SEMI forecasts the 2012 investment level as $2.3 billion worldwide. SEMI Forms Alliance with Korea University SEMI has signed an agreement with Korea Polytechnic University (KPU) to discover and cultivate quality talent for the LED and photovoltaic industries. The memorandum of understanding (MOU) was signed on April 21 by the SEMI Korea president Hyun-dae Cho and the KPU president Jun-young Choi. The MOU between SEMI and KPU launches a training program for LED manufacturing process technology and the first LED manufacturing process training program will take place at the COEX in Seoul from October 24-26, 2011. SEMI FPD Standards Progress Progress was reported from the Metrology meetings in early April. Both the Japan Committee and the Taiwan Committee gave reports, as well as the Task Forces on Backlight Units, Spatial Contrast Ratio, and Perceptual Motion Blur. MEMS Standard Cuts Redundancy and Cost MEMS: MS9-0611 on Microfluidics Specification for High Density Permanent Connections between Microfluidic Devices was recently published. SEMI MS9-0611 was developed to reduce redundant design time, enable more rapid miniaturization of MEMS systems, reduce system complexity, and decrease cost through standardized interfaces. LCD Standards for LED Light Bars SEMI D62-0611 Measurement Method Of Led Light Bar for Liquid Crystal Displays was recently published. This measurement standard defines measurement methods and reporting requirements for various characteristics of light emitting diode (LED) light bar for liquid crystal displays (LCDs). This standard will be helpful to unify methodologies measurement used for electro-optical and mechanical characteristics which can be used to improve the quality of integrated LED backlight units and track conformity to original design rules. | |||||||||||||||||||||||||
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