SEMICON West 2016 Members Only

SEMICON West 2016 Members Only: Selected Presentations

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Manufacturing Next-Generation Process Nodes
Michael Lercel, ASML

193 Lithography, The Saga Continues
Steve Renwick, Nikon Research Corporation of America

Challenges & Opportunities for Next Generation of Miniaturized Sensors
Sanjay Bhandari, mCube Inc.

EMBEDDED SENSOR Processing
Igino Padovani, Bosch

Emerging MEMS Technologies to Watch
Alisa Fitzgerald, AMFITZGERALD & Associates

Lithography, design and device physics
Lucian Shifren, ARM Research

MEMS Manufacturing in China
Peter Himes, SITRI Innovations

Self-aligned patterning technologies for N7-N5
Ben Rathsack, Tokyo Electron Limited

Technology Options for Next Generation Miniaturized Mobile Sensors
Martin Schrems, ams  AG

The Lithographic Journey from the 10-nm to the 5-nm node
Harry J. Levinson, GlobalFoundries

The Materials Path from 10nm to 5nm
Mark Slezak, JSR Micro

What are the next opportunities in MEMS
Yole Développement

New Era of Power Devices
Benjamin Lee, Applied Materials

2.5D/3D Integration Technology
Mukta G. Farooq, Ph.D, Global Foundries

Tutorial: GaN Devices and Technology
Patrick Fay, University of Notre Dame

SiC MOSFETs for Next Generation Power Electronics
P. Sandvik, General Electric Company

NY-Power Electronics Manufacturing Consortium (PEMC)
Paul Farrar Jr., NY PEMC