SEMICON West 2016 Highlights

SEMICON West 2016 Highlights

The 46th annual SEMICON West has over 700 exhibitors, connection to over 26,000 professionals from across the entire electronics supply chain, and 250 total hours of programming and events presented by industry leaders. No other event in North America connects you to:

  • Innovation – What’s new and what’s next in microelectronics
  • Opportunity – Networking, customer/supplier engagement, partnerships
  • Technology – Products, solutions, and services for microelectronics manufacturing 
  • Information – Ideas, trend, forecasts, solutions

Exhibitor info

In Numbers

  • Over 26,000 attendees in 2015 with 17% international visitors
  • Total Exhibit Area 320,000 sq. ft.


Premier Sponsors 2016




What’s New?

  • Advanced Packaging Forum (July 12th-14th, TechXPOT North): A three-day event that features the latest on SiP and vertical configurations
  • Flexible Hybrid Electronics Forum (July 12th-13th, Moscone North, Hall E, Room 132): This two-day event tackles the integration of ultra-thin silicon components and flexible substrates fit for IoT
  • IC Design Summit (July 12th, Keynote Stage, North Hall, Room 134): Speakers will discuss the growing semiconductor demand in relation to automotive electronics industry and the implications of trusted IC and other products across the value chain on security.

Programs at SEMICON West

o    Advanced Manufacturing Forum

o    Advanced Packaging Forum

o    Test Forum

o    Sustainable Manufacturing Forum

o    Silicon Innovation Forum

o    Flexible Hybrid Electronics Forum

o    World of IoT Forum

  • Partner Programs: imec, Leti, SCREEN, Women in Technology Forum, SEMI/MEMS & Sensors Industry Group
  • University Day (July 14th 10:00am-3:00pm, Esplanade Hall, Room 304): A networking opportunity that allows students to learn about the microelectronics industry, connect with industry representatives, and explore career opportunities.

Executive Events

  • Test Executive Panel (July 12th 10:30am-12:30am, Moscone North, Hall E, Room 131): Including Octavio Martinez, sr. Director of Engineering, Qualcomm; Dale Ohmart, test engineering, Texas Instruments; Michael Villemain, CEO, Presto Engineering; Mike Slessor, FormFactor
  • "CONNECT" Executive Summit (July 13th 9:00am-10:00am) explores ways to rationalize value capture with R&D investment, along with discussions on how to collaborate together in the interdependent extended supply chain. Join these leading industry executives as they weigh in on these ever-evolving themes.
  • Bulls and Bears (July 13th 3:00pm-4:30pm, W Hotel) This panel will provide an update on the state of the microelectronics industry now and outlook for the future.

Pavilions, Special Exhibits & Displays

  • International Pavilions:
    • Europe Pavilion (South Hall, Booth 2028)
    • Silicon Saxony (South Hall, Booth 1829)
    • Malaysia Pavilion (North Hall, Booth 5652)
  • Technology Pavilions:
    • 3D Manufacturing Pavilion (South Hall)
    • Compound Semiconductor Pavilion (South Hall)
    • Secondary Equipment Pavilion (South Hall)    
    • Innovation Village- Start-up Showcase (North Hall)
    • Innovation Village- Research and Science Park (North Hall)
    • World of IoT Showcase (North Hall)

Partner Programs         

TechXPOT South: Advanced Manufacturing Forum

TechXPOT North: Advanced Packaging Forum