SEMI integrated Packaging, Assembly and Testing (SiPAT) Special Interest Group

SEMI integrated Packaging, Assembly, and Testing (SiPAT) Special Interest Group

The SEMI integrated Packaging, Assembly, and Testing (SiPAT) Special Interest Group represents SEMI members who have semiconductor packaging, assembly, or test manufacturing and/or design capabilities and capacities in semiconductor or related industries.

The European chapter is the first chapter of this global interest group. The main goal of the European SiPAT Group is to promote the sustainable development of the Semiconductor Packaging, Assembly and Test industry in Europe.  

Join us!  
If you are interested in joining this European Chapter of SEMI Special Interest Group focused on the common issues of packaging, assembly and testing, please contact Anne-Marie Dutron at

SiPAT Information


SiPAT News and Events



European SiPAT Member List

Ayad Ghannam
3DiS Technologies

Hervé Delabre
Project Development Manager
AEMtec GmbH

Cassandra Melvin
Global Product Manager

Gilles Poupon
International Expert

Yovav Yahav-Amir
Managing Director
E.K.S.S. Microelectronics Ltd

Lutz Mattheier
Manager Technology & Process Development
First Sensor Microelectronic Packaging GmbH

Gilles Fresquet
Vice President
Fogale Nanotech

Sven Rzepka
Head of Micro Materials Center
Fraunhofer ENAS

Tanja Braun
Fan-out Wafer & Panel Level Packaging Program
Fraunhofer IZM

Thomas Fries

Steffen Kroehnert
Director of Technology

Eef Bagerman
Sr Director Package Innovation
NXP Semiconductors

Thomas Oppert
Vice President Global Sales & Marketing
Pac Tech

Andy Longford
PandA Europe

Cedric Mayor
Presto Engineering

Gerd Jungmann
Business Development SiP
Swissbit Germany AG

Dieter Schreiber
Sales & Marketing Director

Ignas van Dommelen
Manager Sales & Marketing
Sencio BV

Michel Garnier
Packaging Director

Anne Marie Dutron
SEMI Europe

Jerome Azemar
Senior Analyst & Business Development Manager
Yole Developpement





Purpose of the European SiPAT

To facilitate collective engagement and support the resolution of issues that can be more effectively undertaken as an industry association rather than as individual companies. These actions may include but are not limited to:

  • Developing and maintaining a strong back-end network in Europe
  • Increasing mutual awareness between European suppliers and device / packaging manufacturers
  • Identifying and reporting capabilities and capacities of European SiPAT members
  • Analyzing the gaps in the European back-end supply chain as compared to other regions and communicating this gap to decision makers
  • Advocating and lobbying for the EU Packaging, Assembly & Test industry
  • Initiating EU-funded project proposals