SEMI integrated Packaging, Assembly and Testing (SiPAT) Special Interest Group

SEMI integrated Packaging, Assembly, and Testing (SiPAT) Special Interest Group

The SEMI integrated Packaging, Assembly, and Testing (SiPAT) Special Interest Group represents SEMI members who have semiconductor packaging, assembly, or test manufacturing and/or design capabilities and capacities in semiconductor or related industries.
The European chapter is the first chapter of this global interest group. The main goal of the European SiPAT Group is to promote the sustainable development of the Semiconductor Packaging, Assembly and Test industry in Europe.

Join us!

If you are interested in joining this European Chapter of SEMI Special Interest Group focused on the common issues of packaging, assembly and testing, please contact Anne-Marie Dutron at


Purpose of the European SiPAT

To facilitate collective engagement and support the resolution of issues that can be more effectively undertaken as an industry association rather than as individual companies. These actions may include but are not limited to:

  • Developing and maintaining a strong back-end network in Europe
  • Increasing mutual awareness between European suppliers and device / packaging manufacturers
  • Identifying and reporting capabilities and capacities of European SiPAT members
  • Analyzing the gaps in the European back-end supply chain as compared to other regions and communicating this gap to decision makers
  • Advocating and lobbying for the EU Packaging, Assembly & Test industry
  • Initiating EU-funded project proposals 



  • SAVE THE DATE - next ESiPAT f2f meeting at SEMICON Europa 2016 (Grenoble, France) on October 26, 2016

Date: October 26, 2016
Time: 15:00–16:30 (room available for separate meetings until 18:00)
Location: Room Les Bans, Alpexpo




ESiPAT Organizational Structure

European SiPAT Charter and By-Laws


European SiPAT Member List


Marco Koelink
Business Development Manager
Advanced Packaging Center B.V


Hervé Delabre
Project Development Manager
AEMtec GmbH

 Ari Kuukkala
Sales Director
Afore Oy
 Frederic Beaudoin
Director Strategic Accounts
Amkor Technology Euroservices
 Frederic Mauron
International Sales Engineer
Aptasic SA
 Bernd Roelfs
Global Product Manager, Semiconductor Advanced Packaging
 Lutz Mattheier
Manager Technology & Process Development
First Sensor Microelectronic Packaging GmbH
 Sven Rzepka
Head of Micro Materials Center
Fraunhofer ENAS
 Tanja Braun
Fan-out Wafer & Panel Level Packaging Program
Fraunhofer IZM
 Thomas Fries
 Markus Keil
HSEB Dresden GmbH
 Danny Lambrichts
Group Leader Asic Production
 Steffen Kroehnert
Director of Technology
 Thomas Oppert
Vice President Global Sales & Marketing
Pac Tech
 Cedric Mayor
Presto Engineering
 Dieter Schreiber
Sales & Marketing Director
 Ignas van Dommelen
Manager Sales & Marketing
Sencio BV
 Gerd Jungmann
Business Development SiP
Swissbit Germany AG
 Gilles Fresquet
Unity SC



















































Anne-Marie Dutron
SEMI Europe