MEMS & Sensors Executive Congress
Call for Papers - OPEN
Conference Theme: MEMS & Sensor Systems: Creating Sixth Senses
Event Date: November 1-2, 2017
Location: Napa Valley, California, USA
We are accepting abstracts for the MEMS & Sensors Executive Congress focused on system integration and system solutions. We are looking at presentations that address a holistic approach to integration of sensors into solutions or products or increasing the value of products through additional functionality on the device itself.
Abstract Deadline: May 15, 2017
Abstract Acceptance Notification: July 5, 2017
Presentation Due Date: September 1, 2017
SEMICON Europa 2017 — co-located with Productronica
Event Date: November 14-17, 2017
Location: Munich, Germany
The call for papers for SEMICON Europa 2017 is now open. We invite you to submit an abstract and contribute for an event featuring more than 100 hours of technical sessions and presentations focused on critical industry topics shaping the design and manufacturing of semiconductors. This year the main themes are:
Advanced Packaging, Power Electronics, Flexible Electronics, and Materials.
Questions? Contact Christina Fritsch at firstname.lastname@example.org.
Abstracts Due: May 24, 2017
Notification: June/July 2017
Event Date: April 25-27, 2017
Location: Penang, Malaysia
In alignment to the theme for SEMICON Southeast Asia 2017, Transforming Southeast Asia Semiconductor Landscape for the New Hybrid Age, the technical programs at SEMICON Southeast Asia 2017 will relate to the topics circulating this transformation, setting the industry readiness for the integration.
Abstract & Biography Submission by 31 Jan, 2017
Confirmation/Acceptance of paper by 28 Feb, 2017
Speaker's Letter of Publishing Agreement by 3 Mar, 2017
Speaker's Presentation/Paper by 10 Mar, 2017
Event Date: June 19-22, 2017
Location: Monterey, California, USA
FlexTech, NextFlex, NBMC, SEMI and the 2017FLEX Executive Committee invite you to submit an abstract of a paper or student poster for the 16th Annual Flexible and Printed Electronics Conference - www.2017FLEX.com. The annual event highlights the latest technical breakthroughs and demonstrations of flexible hybrid and printed electronics products, equipment, processes and materials and the applications they enable.
Abstract Deadline: February 15, 2017
Notification of Acceptance: February 28, 2017
Final Presentation Due: June 12, 2017
China Semiconductor Technology International Conference
Call for Papers - CLOSED
Event Date: March 12-13, 2017
Location: Shanghai, China
Welcome to CSTIC 2017, one of the largest and the most comprehensive annual semiconductor technology conferences in China and the World since 2000. CSTIC is organized by SEMI and IEEE-EDS, co-organized by IMEC and ICMTIA(The Integrated circuit Materials Industry Technology Innovation Alliance).Abstract Deadline: September 30th, 2016
Abstract Acceptance Notification: October 15th, 2016
Manuscript Deadline: December 19th, 2016
Event Date: February 8-10, 2017
Location: Seoul, Korea
The SEMI Technology Symposium (STS) 2017, held in conjunction with SEMICON Korea 2017, will provide a dynamic agenda of sessions and presentations on a wide variety of topics in the area of next-generation semiconductor manufacturing. Topics covered include: Advanced Lithography, Interconnection & Advanced Process, Device, Plasma Science and Etching, Contamination-free Manufacturing and CMP Technology, and Electropackage System and Interconnect Product.
Abstracts Due: September 30, 2016
Author Notification: October 31, 2016
Speaker Letter of Agreement Due: November 30, 2016
Paper/ PowerPoint Presentation Due: December 31, 2016
Event Dates: May 15-18, 2017
Location: Saratoga Springs, New York, USA
The call for papers for the 2017 SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2017) is now closed. With technical sponsorship from IEEE, ASMC has been a leading international technical conference for exploring solutions to improve the collective microelectronics manufacturing expertise. Solving the challenges presented by semiconductor manufacturing is an ongoing collaborative effort by users, device makers, equipment and materials suppliers and academia. ASMC provides an unparalleled platform for semiconductor professionals to network and learn the latest information in the practical application of advanced manufacturing strategies and methodologies. The conference is now soliciting abstracts in multiple topic areas from professionals involved in all areas of semiconductor manufacturing. In addition to publication in the conference proceedings, select papers will be invited to participate in a special section of ASMC 2017 to be featured in the IEEE Transactions on Semiconductor Manufacturing. For more information, visit the ASMC Author Kit. Questions? Contact Margaret Kindling at email@example.com.
IMPORTANT DATES (subject to change)
Abstracts Due: 17 October 2016
Second Call for Papers- Abstracts Due: 1 November 2016
Manuscripts Due: 27 February 2017
Final Manuscripts Due: 17 April 2017
Presentations Due: 8 May 2017
ASMC Mailing List: Make sure you receive the latest information about ASMC 2017. Add your name to the ASMC distribution list.