Session 8: FHE Manufacturing Methods II
Flexible Hybrid Electronics Fabricated with High-Performance COTS ICs using RTI CircuitFIlmTM Technology
Wednesday, June 21, 2017
8:45 AM - 9:05 AM
Flexible hybrid electronics is a rapidly growing field which is driven by applications such as wearable sensors and flexible displays. For flexible electronics to take full advantage of the computing power available in semiconductor circuits, the use of COTS high performance devices is of high importance. RTI CircuitFilmTM technology leverages the advanced 3D integration processes of wafer thinning, bonding, and direct interconnects to enable the embedding of thinned COTS devices into flexible substrates for advanced systems. Thinned COTS devices maintain their performance characteristics even when they are 30µm thick and highly flexible. The RTI CircuitFilmTM process incorporates standard semiconductor process technologies to provide good control of the fabrication process. A demonstration system was fabricated and tested at the Micross Advanced Interconnect Technology facility using the RTI CircuitFilmTM technology. Results will be presented of this proof-of-concept demonstration, and potential applications of the RTI CircuitFilmTM technology presented.
Scott H. Goodwin received the B.S. degree in electrical engineering in 1979 and the M. Eng. degree in 1980 from RPI. He received the Ph.D. Degree in electrical engineering from Stanford University in 1984. From 1984 until 2005 he was at MCNC. Initial work there was focused on the device and process designs for 1.0, 0.8, 0.5, and 0.25m CMOS technologies including two-dimensional doping profile measurements. His interests expanded to involve MEMS activities at MCNC including developing the IFA, and the artificial eyelid, two polymer based flexible film electrostatic actuators; as well as other MEMS structures. In 2005 the research groups of MCNC were transferred to RTI International, the Electronics and Applied Physics Division, where Dr. Goodwin continued his work on MEMS structures. For the past ten years he has worked in the area of 3D electrical interconnects and silicon interposers. In 2016 Micross Components acquired the majority of the Electronics and Applied Physics Division forming Micross Advanced Interconnect Technology.
Micross Advanced Interconnect Technology