Session 21: Process Control
Direct digital manufacturing of human temperature monitoring device using flip chip method into silicone encapsulant
Thursday, February 15, 2018
2:45 PM - 3:05 PM
The process of 3D printing circuits usually follow: substrate, trace, chip, encapsulant order. This bottom up order only allows a thin layer of encapsulant to be printed due to the material being in liquid state before curing. Our suggested method suggests printing the encapsulant first, then placing flipped chips down and flooding more encapsulant to cover the chips but not the legs. The legs are then milled off before the conductive traces are printed followed by the substrate material to embed the circuit. This allows for a higher encapsulant to substrate ratio to allow for more flexible circuits without compromising the protection of the chips.
Sami Hawasli graduated with a Bachelors in electrical engineering from Vanderbilt University in 2006 and went on to receive his PhD in electrical engineering from the University of Virginia in 2014. His graduate work focused on device and circuit level design and fabrication for millimeter and submillimeter wave applications using Gallium Arsenide Schottky diodes. After graduation Sami worked for Keysight Technologies within the semiconductor fabrication facility where he oversaw all the backside photolithography processing as well as developed new lithographic processes for future Keysight devices. In 2015, Sami joined the Army Research laboratory where he now works to design and fabricate novel 3D printed flexible circuity.
Army Research Laboratory