Douglas Hackler - New Silicon Frontiers: Physically Flexible System-on-Chip

Session 5: FHE Manufacturing Methods I

New Silicon Frontiers: Physically Flexible System-on-Chip
Tuesday, June 20, 2017 
3:40 PM - 4:00 PM

Ideally, integrated circuits (ICs) should be as flexible as printed substrates for optimum FHE systems. Silicon-on-Polymer (SoP) technology has demonstrated fully flexible ICs that bend like a sheet of paper. American Semiconductor, working with AFRL, is addressing the necessary reliability characterization for implementation of SoP ICs for fully flexible FHE systems.

This paper describes the next major breakthrough that builds on the new SoP technology and will create the primary building block missing today for viable flexible hybrid electronic (FHE) applications – a high-performance, industry standard System-on-Chip (SoC). Requirements for FHE technology include things such as sensors integrated for human performance augmentation, smart labels for asset tracking/monitoring and surveillance, structural performance monitoring, low mass electronics for smart munitions and surface appliqués for next generation UAV manufacturing.

Although several basic ICs have been demonstrated in SoP, an advanced MCU is not currently available. This paper introduces a flexible “Swiss army knife” flexible SoC which utilizes SoP technology to meet the broad needs of NextFlex, AFRL’s Integrated Direct Write Electronics, and Nano-Bio Manufacturing Consortium (NBMC) programs for flexible processing. The device will include a low power MCU core, non-volatile memory, analog-to-digital converter, configurable OPAMPs, capacitive sense module, and will be approximately 1 mil (~25um) in total thickness and capable of conformal/dynamically flexible applications to less than a 5 mm radius of curvature.

This presentation will describe an overview of the FleX-SoC, provide updated test and reliability data, and discuss advanced integration methods.

 

Speaker's Biography

As a seasoned semiconductor leader for over 30 years, Doug has a proven industry track record of assembling and managing engineering, operations, marketing and management teams. He is President & CEO of American Semiconductor, having co-founded the company in 2001, and is a co-inventor of Semiconductor-on-Polymer technology. At American Semiconductor Doug maintains overall corporate and operational responsibilities. He is a flexible electronics industry advocate and leader who is known for his commitment to industry development of new flexible products. He has more than 30 years of experience in wafer fabrication, process development, manufacturing and commercialization at M/A-Com, Zilog, Intel, NorTel and General Instrument. Doug has served as the Principal Investigator (PI) on multiple projects, generated multiple patents and patents pending for conventional and flexible solid state technology and has published numerous technical papers. Mr. Hackler holds engineering degrees from the University of Idaho (MSEE), Boise State University (BSEE) and in management from Texas Tech University (BBA).

 


SPEAKER
Douglas Hackler
American Semiconductor Inc.