Session 18: Printing Technology
Research on Manufacturing of Plastic Films and Filaments through Roll to Roll Processing
Thursday, June 22, 2017
9:05 AM - 9:25 AM
Through ultrasonic hot embossing, a stack of several films with 50 to 300 μm thickness are usually used to imprint microstructures. In order to replace the manual steps, an automated roll-to-roll processing should be developed.
By automating the time-consuming steps such as positioning, fixing and demoulding, the ultrasonic hot embossing which previously has been used only in laboratory operation will be more profitable for mass production. In this case, films up to six feed rollers can be combined into a stack, embossed and rewound into a roll. Also the automatic embossing of microfluidic structures such as straight channels or heat exchangers with a depth up to 1 mm was investigated and minimum cycle times were determined. For the reason that temperature has a direct influence on embossing result, the temperature profile especially during the short cycle times in the ultrasonic hot embossing were examined. With an active cooling of instrument and sonotrode, short cycle times from 2 to 4 seconds can be achieved.
In addition to plastic films, plastic filaments could be microstructured in a roll-to-roll processing. In this case, microstructured plastic filaments which were installed as sensors in synthetic fiber ropes were needed to indicate its rope discard. The mentioned microstructures act as a predetermined break points which break under determined loads of the rope. Via current structure of automated systems only one filament can be processed while by adapting the sonotrode and winding, several filaments could be manufactured simultaneously.
Reza Mahboubfar is a mechanical engineering student at FH Aachen University of Applied Sciences.
He has worked in 2012 for 6 months in the field of the ECU software testing on the Hil test stand for the industrial partner Siemens at the Institute of Automatic Control lRT RWTH Aachen.
In 2013 he has been active for one year in the area of mounting and connection technology of flexible circuit carriers at the Fraunhofer Institute for Production Technology IPT Aachen.
His current research involves study of Roll to Roll processing of microstructures by ultrasonic hot embossing.