MRSI Systems Announces "One Stop Shop" Die Bonding Solutions at CIOE and ECOC

MRSI Systems Announces "One Stop Shop" Die Bonding Solutions at CIOE and ECOC

Thursday, Aug 30, 2018

STOCKHOLM, Aug. 30, 2018  --

MRSI Systems (Mycronic Group) will be demonstrating our "One Stop Shop" capabilities at the 20th China International Optoelectronic Exposition (CIOE) at the Shenzhen Convention and Exhibition Center with our partner CYCAD Century Science and Technology (Booth #1C66) in Shenzhen, September 5-8, 2018.

The biggest challenge facing photonics manufacturing is how to handle high volume and high mix production. To solve this problem requires flexible high speed automation.

MRSI Systems is pleased to announce our "One Stop Shop" die bonding solutions. Our die bonders are historically regarded the leaders in flexibility and during the year we have expanded this product family with additional configurations. These products provide superior flexibility for true multi-die, multi-process, multi-product high volume high mix production. These high speed products deliver the industry-leading speed without sacrificing flexibility, precision or reliability.

"Our 'One Stop Shop' solutions will help our customers to enable just-in-time supply and fast-pace innovations of critical photonic component for high growth market segments such as hyper-scale data centers, photonic sensors, and 5G wireless," stated Dr. Yi Qian, Vice President Product Management of MRSI Systems. "MRSI Systems has been serving optoelectronic and microelectronic customers for the past thirty-four years and understands their requirement to scale efficiently in today's fast paced marketplace. MRSI is pleased to meet these needs with the expansion of our high speed die bonder families for high volume manufacturing of photonics packaging," said Mr. Michael Chalsen, President of MRSI Systems.

With our "One Stop Shop" solutions, we can meet whatever volume our customers face:

  • The ultra-flexible MRSI-705 and MRSI-M3 can be used for research and development prototyping to low/medium volume.
  • The ultra-fast MRSI-HVM3 and MRSI-H3 can meet high volume requirements for all key die bonding applications in photonics manufacturing with superior flexibility for multi-dies, multi-process, and multi-products through one machine. 
  • Finally, our ultra-fast product families deliver <3 micrometer placement accuracy for next generation products.

Pick up a copy of the Visitor Guide at CIOE and stop by our partner CYCAD's Booth #1C66 to see a live demo of our ultra-fast die bonder, discuss your requirements and learn more about our "One Stop Shop" solutions that are designed for you.

MRSI Systems will also be exhibiting at ECOC (Booth #577) in Rome, Italy September 24-26, 2018. For more information visit our website or contact us to schedule a meeting at CIOE and ECOC.

For additional information, please contact: Dr. Yi Qian Vice President of Product Management, MRSI Systems  Tel: +1-(978)-667-9449, e-mail:  Time Zone: ET – Eastern Time

Tobias Bülow Director IR & Corporate Communications, Mycronic Tel: +46-734-018-216, e-mail:  Time Zone: CET – Central European Time