MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3μm high speed die bonder, optimized for bonding large dies for high power diode lasers, that are used in advanced photonics such as industrial lasers, optical fiber amplifications, lighting, and sensors.
High power diode lasers are critical components for multiple markets and have seen a significant, continual rise in adoption with the explosion in new applications. The new MRSI-H3LD is equipped for speed with "on-the-fly" auto tool changer integrated on the bonding head for zero time tool change-over with ultrafast-ramp eutectic station for reduced cycle time. Combining both, MRSI-H3LD demonstrates the highest throughput in industry for the high power diode laser die bonding. "The new MRSI-H3LD product carries key technological building blocks from our field proven flexible high speed MRSI-HVM3 platform for industry leading throughput, superior flexibility, and future-proven 3μm placement accuracy. It enables our high power diode laser and other photonics customers to scale up their business," said Dr. Yi Qian, Vice President of Product Management of MRSI Systems.
MRSI-H3LD has a placement accuracy of <3μm (±3σ). The precision is achieved without sacrificing high speed or flexibility and helps high power diode laser manufacturing to achieve smaller offset between the front facets of laser diode and the front end surface of the submount. It is also equipped with self-leveling collets specially designed for large high power laser dies to achieve co-planarity between two bonded interfaces.
MRSI Systems is exhibiting at CIOE with our partner CYCAD Century Science and Technology (Booth #1C66) in Shenzhen, September 5-8, 2018 and ECOC (Booth #577) in Rome, Italy, September 24-26, 2018.
For additional information, please contact: Dr. Yi Qian Vice President of Product Management, MRSI Systems Tel: +1 (978) 667-9449, e-mail: email@example.com Time Zone: ET – Eastern Time
Tobias Bülow Director IR & Corporate Communications, Mycronic Tel: +46-734-018-216, e-mail: firstname.lastname@example.org Time Zone: CET – Central European Time
The information in this press release was published August 28, 2018, at 09:00 am ET.