Atotech to present leading fan-out wafer-level packaging technology at SEMICON Taiwan 2017

Atotech to present leading fan-out wafer-level packaging technology at SEMICON Taiwan 2017

Monday, Sep 11, 2017

BERLIN, 11 September, 2017:  Atotech is amongst the leading metallization companies in the semiconductor industry, providing cutting–edge chemistry, equipment and process solutions for advanced wafer metallization.  

As such, Atotech’s experts will showcase the company’s market leading knowledge on fan-out wafer-level packaging at two presentations during this year’s SEMICON Taiwan 2017:  

  • On Thursday, September 14, from 11:00 to 11:30 am, Cassandra Melvin, Global Product Manager Semiconductor Advanced Packaging at Atotech Deutschland GmbH, will present “Optimized Cu plating for fan-out wafer-level packaging” at the TechXPOT, the best platform to learn the latest industry knowledge
  • On Friday, September 15, from 15:50 to 16:15 pm, Dr. Dirk Rohde, R&D Manager Electronics at Atotech Deutschland GmbH, will speak about “Additive impact on Cu properties for fan-out wafer-level packaging applications” at the SiP Global Summit – Embedded and Fan Out Package Technology Forum
     

In her presentation, Cassandra Melvin will focus on the challenges for Cu electroplating in next generation fan-out wafer-level packaging (FO-WLP). She will introduce Atotech's MultiPlate® as turnkey solution for these challenges and present the results achieved on tall Cu pillar wafers with this ECD tool, proving that MultiPlate® provides top plating performance and clear technical advantages.  

Dirk Rohde will present next generation device requirements such as a continuously decreasing RDL pitch and increasing I/O count, and the challenges related in plating such fine features. In his presentation “Additive impact on Cu properties for fan-out wafer-level packaging applications” he will discuss how additives on the molecular scale impact Cu microstructures and provide the audience with the results achieved with a new electrolyte.  

Atotech’s specialists are ready to discuss the company’s innovative solutions for the semiconductor industry following the presentations and during the trade show.  

With the Taiwanese equipment and material market forecast to reach more than USD 18 billion, SEMICON Taiwan is the premier event for microelectronics in Taiwan. The trade show will be held in Taipei, Taiwan, from September 13 to 15, 2017.
 

 

Contact

Yvonne Fuetterer
Erasmusstr. 20
10553 Berlin, Germany
+49 30-349 85-220

Yvonne.fuetterer@atotech.com                    

About Atotech

Atotech is one of the world’s leading manufacturers of specialty chemicals and equipment for the printed circuit board, IC-substrate and semiconductor industries, as well as for the decorative and functional surface finishing industries. Atotech has annual sales of USD1.1 billion. The company is fully committed to sustainability – we develop technologies to minimize waste and to reduce environmental impact. Atotech has its headquarters in Berlin, Germany, and employs more than 4,000 people in over 40 countries.