Session 16: Encapsulation & Coating
From flexible towards foldable thin film encapsulation for air stable OLED devices
Wednesday, June 21, 2017
3:55 PM - 4:20 PM
At Holst Centre, a thin film encapsulation for organic light-emitting diode (OLED) was developed comprising two amorphous hydrogenated silicon nitride layers (SiN) with a relatively thick organic coating for planarization (OCP) in between the SiN layers. This thin film encapsulation can prevent moisture related degradation of OLEDs for >2500h at accelerated climate conditions (60C, 90% rel. hum.) and was successfully transferred to Philips Lighting for OLED production.
Similar thin film barrier can be applied on top of a plastic substrate to enable flexible OLEDs. We have realized flexible OLEDs using this approach and found that the thin film barrier protects the OLEDs for >1500h at 60C and 90% rel. hum. and the barrier remains intact even after 100 000 x rolling over 10mm radius. To advance further we have improved the original concept and realized thin film barrier encapsulated OLEDs that are foldable down to 1mm bending radius. Our contribution will address challenges in development of the flexible and foldable transparent thin film encapsulation and moreover will give a short status of encapsulation technology at Holst Centre.
Pavel Kudlacek obtained his PhD in plasma and thin film physics in 2007. Since then, he worked on several positions in academy and industry on topics related to development and application of thin films in energy efficient and energy harvesting devices. Since 2014 he has been working as Senior Researcher at Holst Centre, developing advanced concepts for transparent, highly flexible, thin film encapsulation of moisture sensitive devices. Currently he is heavily involved in commercialization of an affordable flexible organic light-emitting diode technology.