Packaging Central

Packaging Central

Packaging Highlights​ 

China IC Industry Outlook (SEMI/SST; Oct 17, 2017)

SEMICON Taiwan Part 1: Fan-out Packaging Players, Applications and Market Growth (

Wafer Shipments Forecast to Increase in 2017, 2018 and 2019 (SEMI; Oct 16, 2017)

The Chiplet Option (SemiEngin; Oct 9, 2017)

Integrated Passives Market Gets Active (SemiEngin; Oct 9, 2017)

Advanced Packaging’s Progress (SemiEngin; Oct  9, 2017)

New 3D packaging & integration committee (SST; Oct 2, 2017)

Robotics and chip industries in Japan (SST; Oct 2, 2017)

Laser marking meets diverse challenges in fab and packaging (SST; Sept 22, 2017)

Implementing Fan-Out Wafer-Level Packaging (FOWLP) with an HDAP Flow (3DInCites; Sept 21, 2017)

Fan-out Packaging Confirms its Success Story (3DInCites; Sept 14, 2017)

NextFlex WEBINAR (Oct 25): FLEXINAR: Optimizing Proven Best Practices from Semiconductor and Electronics Packaging for FHE

More than 45,000 Expected at SEMICON Taiwan 2017 ─ Opens Tomorrow (Sept 12, 2017)

Fab Equipment Spending Breaking Industry Records (SEMI; Sept 12, 2017)

Inside Panel-Level Fan-Out Technology (SemiEngin; Sept 11, 2017)

Advanced Packaging For Automotive Dashboard Application (SemiEngin; Sept 11, 2017)

Executive Insight: Lip-Bu Tan (SemiEngin; Sept 6, 2017)

SMTA LA/OC and San Diego Chapters to Hold Facility Tour (IConnect 007; Sept 5, 2017)

Three Trends Expected to Influence Semiconductor Advanced Packaging (Ceramics; Aug 31, 2017)

ASE Tech Forum at Nijmegen Part 1: Advanced Packaging 2017 (SemiMD; Aug 22, 2017)

The 200mm Equipment Scramble (SemiEngin; Aug 24, 2017)

Packaging Articles: Archives

Purchase: Global Semiconductor Packaging Materials Outlook — 2015-2019

      

Upcoming Events

Nov 14-17SEMICON Europa 2017
Dec 13-15SEMICON Japan 2017
Jan 31-Feb 2SEMICON Korea 2018
Mar 14-16SEMICON China 2018
Apr 30-May 3Advanced Semiconductor Manufacturing Conference 2018
May 8-10SEMICON Southeast Asia 2018
July 10-12SEMICON West 2018
More Events 

New from SEMI: Packaging Report

Purchase the Global Semiconductor Packaging Materials Outlook — 2015-2019

Packaging Backgrounder

 Advanced Packaging Market Data from Yole Développement (January 2017)

 

Packaging

SEMI provides both the forum and leadership so companies can confidently participate in an open, informed and professional environment on packaging issues.

Packaging activities are integrated with other SEMI programs, events, products, and initiatives. 

 

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