SAN JOSE, Calif. — December 15, 2016 — North America-based manufacturers of semiconductor equipment posted $1.55 billion in orders worldwide in November 2016 (three-month average basis) and a book-to-bill ratio of 0.96, according to the November Equipment Market Data Subscription (EMDS) Book-to-Bill Report published today by SEMI. A book-to-bill of 0.96 means that $96 worth of orders were received for every $100 of product billed for the month.
SEMI reports that the three-month average of worldwide bookings in November 2016 was $1.55 billion. The bookings figure is 4.0 percent higher than the final October 2016 level of $1.49 billion, and is 25.1 percent higher than the November 2015 order level of $1.24 billion.
The three-month average of worldwide billings in November 2016 was $1.61 billion. The billings figure is 1.1 percent lower than the final October 2016 level of $1.63 billion, and is 25.2 percent higher than the November 2015 billings level of $1.29 billion.
“As 2016 comes towards a close, equipment spending is stronger than expected at the start of the year," said Dan Tracy, senior director, SEMI. "Spending has been driven by 3D NAND, leading-edge foundry, and advanced packaging investments, and these segments are key for the expected spending growth in 2017."
The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.
October 2016 (final)
November 2016 (prelim)
Source: SEMI (www.semi.org), December 2016
The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.
The data are contained in a monthly Book-to-Bill Report published by SEMI. The report tracks billings and bookings worldwide of North American-headquartered manufacturers of equipment used to manufacture semiconductor devices, not billings and bookings of the chips themselves. The Book-to-Bill report is one of three reports included with the SEMI Equipment Market Data Subscription (EMDS).
SEMI® connects more than 2,000 member companies and more than a quarter-million professionals worldwide to advance the science and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, and services that enable smarter, faster, more powerful, and more affordable electronic products. Since 1970, SEMI has built connections that have helped its members grow, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information about SEMI, visit www.semi.org and follow SEMI on LinkedIn and Twitter.
Next SEMI Book-to-Bill: January 24, 2017 at 3:00pm Pacific.
For information on SEAJ Book-to-Bill Report, visit www.seaj.or.jp
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