MILPITAS, Calif. — March 16, 2017 — North America-based manufacturers of semiconductor equipment posted $1.97 billion in billings worldwide in February 2017 (three-month average basis), according to the February Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.
SEMI reports that the three-month average of worldwide billings of North American equipment manufacturers in February 2017 was $1.97 billion. The billings figure is 6.1 percent higher than the final January 2017 level of $1.86 billion, and is 63.8 percent higher than the February 2016 billings level of $1.20 billion.
“Billings levels remain elevated as memory and foundry manufacturers continue to invest in advanced semiconductor technologies," said Ajit Manocha, president and CEO of SEMI. “These investments are paving the way for the ramp of 3D NAND and 1X-nm devices.”
The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.
January 2017 (final)
February 2017 (prelim)
Source: SEMI (www.semi.org), March 2017
SEMI ceased publishing the monthly North America Book-to-Bill report in January 2017. The decision to discontinue the Book-to-Bill report was based on changes in reporting by some participants where the reporting of orders/bookings into the data collection program is no longer considered a necessary component of their industry analysis.
SEMI will continue publish a monthly North American Billings report and issue the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. Beginning with the January 2017 WWSEMS report, bookings information will only be available for the back-end equipment segments of the industry. In addition, SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo.
The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.
SEMI® connects nearly 2,000 member companies and 250,000 professionals worldwide annually to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, and services that enable smarter, faster, more powerful, and more affordable electronic products. Since 1970, SEMI has built connections that have helped its members grow, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org and follow SEMI on LinkedIn and Twitter.
Next SEMI Billings report: April 20, 2017 at 3:00pm Pacific.
For information on SEAJ Book-to-Bill Report, visit www.seaj.or.jp
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