European 3D TSV Summit: Smarter System Integration Theme to Focus on Both Business and Technology

France — September 30, 2014—– On January 19-21, 2015, SEMI will hold its 3rd edition of the European 3D TSV Summit in Grenoble, France.  After the last successful edition that brought over 330 participants from over 21 countries in January 2014, SEMI will renew the Summit in 2015 with the theme: “Enabling Smarter Systems,” focusing on the critical chip integration that 3D through silicon vias (TSV) now play in business strategies and the latest technology advancements. 

North American Semiconductor Equipment Industry Posts August 2014 Book-to-Bill Ratio of 1.04

SAN JOSE, Calif. — September 18, 2014 — North America-based manufacturers of semiconductor equipment posted $1.35 billion in orders worldwide in August 2014 (three-month average basis) and a book-to-bill ratio of 1.04, according to the August EMDS Book-to-Bill Report published today by SEMI.   A book-to-bill of 1.04 means that $104 worth of orders were received for every $100 of product billed for the month.

SEMI Commends House Passage of Bi-Partisan Manufacturing Innovation Act

SAN JOSE, Calif. — September 16, 2014 — SEMI praised the bipartisan effort in the United States House of Representatives to pass H.R. 2996, the Revitalize American Manufacturing and Innovation (RAMI) Act.  SEMI further urged the Senate to move quickly on the legislation that would create public private partnerships to establish institutes for manufacturing innovation.

Europe: Strong Growth in Chip Equipment Spending in 2015; SEMICON Europa Expands by 25%

GRENOBLE, France — 10 September 2014 — SEMICON Europa will feature semiconductor device technology for a wide range of applications, equipment, materials, services and will provide access to critical information relative to device manufacturing, partnership opportunities, next-generation fab requirements  and funding. The event will be held in France (7-9 October in Grenoble) for the first time with an expanded exhibition (25 percent larger). The opportunities and challenges in microelectronics will be discussed in more than 70 sessions with 300 speakers.

Equipment Spending Shows Strong Growth for 2014 and 2015; Slow Capacity Additions

SAN JOSE, Calif. — September 9, 2014 Front End fab equipment spending (including new, used, and in-house) is projected to increase up to another 20 percent in 2015 to US$ 42 billion, according to most recent edition of the SEMI World Fab Forecast.  In 2015, equipment spending could mark a historical record high, surpassing the previous peak years of 2007 ($39 billion) and 2011 ($40 billion).

SEMI Reports Second Quarter 2014 Worldwide Semiconductor Equipment Figures; Billing US$ 9.6 Billion

SAN JOSE, Calif. — September 8, 2014 — SEMI, the global industry association for companies that supply manufacturing technology and materials to the world’s chip makers, today reported that worldwide semiconductor manufacturing equipment billings reached US$ 9.62 billion in the second quarter of 2014. The billings figure is 5 percent lower than the first quarter of 2014 and 28 percent higher than the same quarter a year ago.

SEMICON Taiwan 2014 Opens Today with Spotlight on 3D-IC, Sustainable Manufacturing, and MEMS

TAIPEI, Taiwan — September 3, 2014 — Taiwanese chipmakers, LED manufacturers, and Outsourced Semiconductor Assembly and Test (OSAT) firms will spend firm nearly $24 billion in the next two years on equipment and materials, powering excitement for SEMICON Taiwan 2014, which opened today in Taipei.  Leaders in the industry are convening for the September 3-5 event at the TWTC Nangang Hall.