Industry Ecosystem at Inflection: Industry Strategy Symposium (ISS) 2013 Addresses Perils and Opportunities

SAN JOSE, Calif. — December 12, 2012 — The most influential leaders in microelectronics will convene at the Industry Strategy Symposium 2013 to discuss and debate the future of the semiconductor industry on January 13-16, in Half Moon Bay, Calif.  The unusual format of ISS brings industry executives together to hear diverse perspectives from IC design, manufacturing, foundry, R&D, and consumer electronics.

SEMI Reports Third Quarter 2012 Worldwide Semiconductor Equipment Figures; Billings US$ 9.06 Billion

SAN JOSE, Calif. — December 10, 2012 — SEMI, the global industry association for companies that supply manufacturing technology and materials to the world’s chip makers, today reported that worldwide semiconductor manufacturing equipment billings reached US$ 9.06 billion in the third quarter of 2012. The billings figure is 12 percent lower than the second quarter of 2012 and 15 percent lower than the same quarter a year ago.

2012 Semiconductor Equipment Sales Forecast $38.2 Billion

TOKYO, Japan — December  4, 2012 — SEMI projects that worldwide sales of new semiconductor manufacturing equipment will reach $38.2 billion in 2012, according to the year-end SEMI Semiconductor Equipment Consensus Forecast, released here today at the annual SEMICON Japan exposition. Following a multi-year expansion period, semiconductor equipment sales are expected to moderate before posting low double-digit growth in 2014.

CAST Elects New Leadership to Address Future of Semiconductor Test

SAN JOSE, Calif. — November 26, 2012 —  The Collaborative Alliance for Semiconductor Test (CAST), a SEMI special interest group, has elected new leadership to advance their mission to develop, accelerate and support industry-wide advances in semiconductor test.  Elected by a unanimous vote of the CAST Steering Committee was Chris Portelli Hale, Manufacturing Test director at STMicroelectronics, as CAST chair, and Octavio Martínez, senior director of Engineering, Qualcomm, as vice chair. 

North American Semiconductor Equipment Industry Posts October 2012 Book-to-Bill Ratio of 0.75

SAN JOSE, Calif. — November 15, 2012 — North America-based manufacturers of semiconductor equipment posted $743.2 million in orders worldwide in October 2012 (three-month average basis) and a book-to-bill ratio of 0.75, according to the October Book-to-Bill Report published today by SEMI.  A book-to-bill of 0.75 means that $75 worth of orders were received for every $100 of product billed for the month.

Decrease in Third Quarter 2012 Silicon Wafer Shipments

SAN JOSE, Calif. —  November 12, 2012 — Worldwide silicon wafer area shipments decreased during the third quarter 2012 when compared to second quarter 2012 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Total silicon wafer area shipments were 2,389 million square inches during the most recent quarter, a 2 percent decrease from the 2,447 million square inches shipped during the previous quarter. New quarterly total area shipments are 1 percent greater than third quarter 2011 shipments.

The Power of 3D Integration: SEMI European 3D TSV Summit to Confront the Tough Issues with Exceptional Lineup of Experts

GRENOBLE, France — October 24, 2012 — Global leaders in 3D technology will convene to discuss the latest advances in Grenoble on January 22-23, 2013 at the European 3D TSV Summit.  This new SEMI event will take place in the heart of the French Alps, in one of the most dynamic European semiconductor clusters. It addresses the manufacturing aspects of 3D Integration and Through Silicon Via technology (TSV), with Laurent Malier, CEO of CEA-LETI, opening the event with a keynote positioning TSV technology in the semiconductor innovation landscape.