Printed Electronics Insights: Smart Packaging & IoT Summary

OE-A’s recent industry workshop – Printed Electronics Insights: Smart Packaging & IoT - was hosted at Cambridge University on October 11-12, 2017. Co-sponsored by SEMI | FlexTech and the EPSRC Centre for Innovative Manufacturing in Large Area Electronics, this initial event drew 100+ participants for two days of roadmapping , technical discussions, and networking.