ASMC 2017

28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2017)

May 16-19, 2017
Saratoga Springs, New York


The three-day program will consist of parallel technical sessions, keynotes, tutorials and a panel discussion. The Conference provides an exceptional opportunity to meet face-to-face with industry and academic representatives of local and global companies involved along the microelectronics value chain. The ASMC technical committee is accepting abstract submissions now through October 17, 2016.  For information, view the ASMC 2017 Call for Papers

Why Become an ASMC Speaker?

  • Recognition from industry peers
  • Interaction with representatives from leading manufacturers, suppliers and academics
  • Opportunity to share your knowledge, experiences and practical expertise
  • IEEE Publication
  • Consideration for ASMC 2017 Best Paper award (sponsored by Entegris)

Abstracts are peer-reviewed by members of ASMC technical committee with the goal of developing a high quality, informative conference.  All abstracts are evaluated on the strength of the abstract submitted, including content matter and relevance to semiconductor manufacturing. 

    Call for Papers

    SEMI encourages industry professionals to share their expertise in semiconductor manufacturing.  Submit a technical abstract: ASMC 2017 Call for Papers.  Topics include:

    AM: Advanced MetrologyFA: Factory Automation
    AEPM: Advanced Equipment Processes and MaterialsFE: The Fabless Experience
    AP/DFM: Advanced Patterning / Design for ManufacturabilityGF: Green Factory
    APC: Advanced Process ControlIE: Industrial Engineering
    CFM: Contamination Free ManufacturingLM: Lean Manufacturing
    DM: Data Management and Data Mining ToolsMJ:  MOL and Junction Interfaces
    DI: Defect Inspection and ReductionSM: Smart Manufacturing
    DP: Discrete and Power DevicesYE: Yield Enhancement/Learning
    ET/ ID: Enabling Technologies and Innovative DevicesYM: Yield Methodologies
    ER: Equipment Reliability and Productivity Enhancements3D/TSV: Packaging and Through Silicon Via












    Who Should Attend

    This program is designed for semiconductor industry professionals seeking to expand their microelectronics manufacturing. Attendees would include:

    • IC Manufacturers
    • Equipment Manufacturers
    • Materials Suppliers
    • Chief Technology Officers
    • Operations Managers
    • Process Engineers
    • Product Managers
    • Academia

    Sponsorship Opportunities

    Companies seeking to reach out to decision makers involved in the all aspects of semiconductor manufacturing, microelectronics supply chain can leverage the many promotional opportunities available for this program.  For information, contact Shane Poblete at, telephone +1.202.847.5983

    For More Information

    Please contact Margaret Kindling at, telephone: +1.202.393.5552