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Advanced Semiconductor Manufacturing Conference —ASMC 2017
ASMC is the leading international technical conference for exploring solutions to improve the collective micro-electronics manufacturing expertise. The conference provides an unparalleled platform for semiconductor professionals to network and learn the latest information in the practical application of advanced manufacturing strategies and methodologies. IEEE is a technical sponsor of ASMC 2017. Select ASMC manuscripts are republished in a Special Section of the IEEE Transactions on Semiconductor Manufacturing.
The call for papers has concluded. Abstracts are peer-reviewed by members of ASMC technical committee with the goal of developing a high quality, informative conference. All abstracts are evaluated on the technical merit of the abstract submitted, including content matter and relevance to microelectronics manufacturing. The ASMC technical committee is comprised of professionals from the microelectronics industry and academia.
Thomas Morgenstern, Ph.D.
Tutorial: Piezoelectric MEMS
Congratulations to the 2016 Best Paper Award Winners
2016 Best Paper Award Sponsored by Entegris
HRXRD for In-Line Monitoring of Advanced FD-SOI Technology: Use Cases
2016 Best Student Paper Award Sponsored by GLOBALFOUNDRIES
Management of Crisis Situations in a Large Unified AMHS of a Semiconductor Manufacturing Facility
Dick James, Senior Technology Analyst, Chipworks on ASMC:ASMC is an annual conference focused on the manufacturing of semiconductor devices; it differs from other conferences; the emphasis is on what goes on in the wafer fab, not the R&D labs, and the papers are not research papers – some are better described as “tales from the fab”! I always come away from ASMC impressed by the quality of the engineering involved; not being a fab person myself any more, it’s easy to get disconnected from the density of effort required to equip a fab, keep it running and bring new products/processes into production. Usually the guys in the fab only get publicity if something goes wrong! After all, it’s the nitty-gritty of manufacturing in the fab that gets the chips out of the door—ASMC discusses the work that pushes the yield and volumes up and keeps them there.