ASMC 2017

 

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Advanced Semiconductor Manufacturing Conference —ASMC 2017

Abstract Deadline: October 17, 2016

Conference dates:
May 15-18, 2017
Saratoga Springs, New York

 
 

SEMI and IEEE invite authors to submit a technical abstract for ASMC 2017.

ASMC is now soliciting abstracts in 20 topic areas from professionals involved in all areas of microelectronics manufacturing. Authors of selected papers will have an opportunity to present their work at the conference. They will also receive an invitation to publish their paper in a special section of ASMC 2017, which will be featured in IEEE Transactions on Semiconductor Manufacturing.

About ASMC

ASMC is the leading international technical conference for exploring solutions to improve the collective micro-electronics manufacturing expertise. The conference provides an unparalleled platform for semiconductor professionals to network and learn the latest information in the practical application of advanced manufacturing strategies and methodologies.  IEEE is a technical sponsor of ASMC 2017.

 

      Why Become an ASMC Speaker?

  • Recognition from industry peers
     
  • Interaction with representatives from leading manufacturers, suppliers and academics
     
  • Opportunity to share your knowledge, experiences and practical expertise
     
  • IEEE Publication Opportunity
     
  • Consideration for ASMC 2017 Best Paper award (sponsored by Entegris) and the ASMC 2017 Best Student Paper (sponsored by GLOBALFOUNDRIES) 

CALL FOR PAPERS TOPICS

SEMI encourages industry professionals to share their expertise in semiconductor manufacturing and submit a technical abstract for one of the following topics:

AEPM: Advanced Equipment Processes and Materials

AM: Advanced Metrology

AP/DFM: Advanced Patterning/Design for  Manufacturability

APC: Advanced Process Control  IE: Industrial Engineering

CFM: Contamination Free Manufacturing

DI: Defect Inspection and Reduction

DM: Data Management and Data Mining Tools

DP: Discrete and Power Devices

ER: Equipment Reliability and Productivity Enhancements

ET/ID: Enabling Technologies and Innovative Devices

 

FA: Factory Automation

FE: The Fabless Eperience

GF: Green Factory

LM: Lean Manufacturing

MJ: MOL and Junction Interfaces

SM: Smart Manufacturing

YE: Yield Enhancement/Learning

YM: Yield Methodologies

3D/TSV: Packaging and Through Silicon Via

   

IMPORTANT DATES

  • Abstracts Due:
  • Author Notification:  
  • Manuscripts:          
  • Final Manuscripts:     
  • Presentations:          
  • Conference Dates:    

October 17, 2016
December 15, 2016
February 27, 2017
April 17, 2017
May 8, 2017
May 15-­17, 2017

Abstracts are peer-reviewed by members of ASMC technical committee with the goal of developing a high quality, informative conference. All abstracts are evaluated on the technical merit of the abstract submitted, including content matter and relevance to microelectronics manufacturing.  The ASMC technical committee is comprised of professionals from the microelectronics industry and academia.

2017 Best Paper Award
Sponsored by Entegris

All papers will be considered for the ASMC 2017 Entegris Best Paper Award. 

 

2017 Best Student Paper Award
Sponsored by GLOBALFOUNDRIES

Papers authored and presented by a student or student/professor will receive special consideration for the 2017 ASMC Outstanding Student Paper competition, sponsored by GLOBALFOUNDRIES.

Sponsorship Opportunities
Reach out to decision makers involved in the all aspects of semiconductor manufacturing, and the microelectronics supply chain by sponsoring ASMC. To find out about the available promotional opportunities contact:
Shane Poblete
spoblete@semi.org
Tel: +1.202.847.5983

  

Call for Papers or Conference Questions
Margaret Kindling
mkindling@semi.org
Tel: +1.202.393.5552.