Packaging Central

Packaging Central

Packaging Highlights  

Return Of The Organic Interposer (Semiconductor Engineering; Aug. 6, 2018)

TechSearch International Analyzes Trends in Packages for AI Applications (3D InCites; Aug. 2, 2018)

Bridges Vs. Interposers (Semiconductor Engineering; July 12, 2018) 

3D Semiconductor Packaging Market to See Incredible Growth During 2025 (Energy News: July 10, 2018)

Optimized stepping for fan-out wafer and panel packaging (Solid State Technology; July 9, 2018)

Material innovations for advancements in fan-out packaging (Solid State Technology; July 9, 2018)

Transforming the Fan-out Landscape (3DInCites; June 26, 2018)

TSMC dominance in 7nm process enhanced with InFO package (DigiTimes; June 25, 2018)

Advanced Packaging Confusion (Semiconductor Engineering; June 13, 2018)

Extending The IC Roadmap (Semiconductor Engineering; June 11, 2018)

New Transistor Types Vs. Packaging (Semiconductor Engineering; June 11, 2018)

ECTC 2018 Paves the Path to Heterogeneous Integration (3DInCites; June 5, 2018)

The Advanced Packaging Industry is on the Move (3DInCites; June 1, 2018)

Shower Heads Installed in Packaging Could Keep Chips Cool (Electronic Design; May 29, 2018)

Packaging Materials (Solid State Technology; May 21, 2018)

OSAT Consolidation Continues (Semiconductor Engineering; May 14, 2018)

Thermal Metamaterials for Advanced Packaging Applications from Stanford University (3DInCites; May 11, 2018)

Early Chip-Package-System Thermal Analysis (Semiconductor Engineering; May 10, 2018)

UnitySC Opens New Asia Entity to Support Advanced Packaging and Power Device Markets (3DInCites; May 8, 2018)

Packaging Chips For Cars (Semiconductor Engineering; May 7, 2018)

MIS Packaging Takes Off (Semiconductor Engineering; May 7, 2018)

IFLE 380 IMAPS Device Packaging Conf Part 3: Yole Updates FO-WLP (Solid State Technology; Apr. 25, 2018)

There’s a Fan-out for That (3DInCites; Apr. 24, 2018)

OSAT firms see flip-chip package orders eroded by digital coin price swings (DigiTimes; Apr. 20, 2018)

Semi packaging materials market reaches $16.7bn (; Apr. 19, 2018)

Embedded Die Packaging Emerges (Semiconductor Engineering; Apr. 9, 2018)

TEL Sells Packaging Tool Unit (Semiconductor Engineering; Apr. 4, 2018)

TSMC advanced packaging seen crucial for HPC chips (DigiTimes; Apr. 3, 2018)

China now world’s largest consumer of semiconductor packaging equipment and materials (Solid State Technology; Apr. 2, 2018 )

Packaging, Innovation, and Our Application-Driven World (3DInCites; Apr. 2, 2018)

New packaging tech FOPLP rising to spur demand for advanced equipment (DigiTimes; Mar. 28, 2018)

Designing and Integrating MCM/SIP Packages into Systems PCBs (3DInCites; Mar. 26, 2018)

Advanced Packaging Trends – Part II: Solving Lithography Challenges (3DInCites; Mar. 26, 2018)

New Issues In Advanced Packaging (Semiconductor Engineering; Mar. 8, 2018)

Is Advanced Packaging The Next SoC? (Semiconductor Engineering; Mar. 5, 2018)

Toward High-End Fan-Outs (Semiconductor Engineering; Mar. 5, 2018)

Designing and Integrating MCM/SIP Packages into Systems PCBs (3DInCites; Mar. 1, 2018)

Citius, Altius, Fortius: Packaging Topics at SEMICON Korea 2018 (3DInCites; Feb. 23, 2018)

Cheaper Packaging Options Ahead (Semiconductor Engineering; Feb. 5, 2018)

Taiwan IC packagers to cash in on mining craze in 2018 (DigiTimes: Jan. 30, 2018)

Kulicke & Soffa to Participate at SEMICON Korea 2018 (Markets Insider; Jan. 29, 2018)

The Week In Review: Manufacturing (Semiconductor Engineering; Jan. 19, 2018)

The 14th ASIP Addresses a Spectrum of Advanced Packaging Opportunities, Part 2 (3DInCites; Jan. 15, 2018)

Advanced Packaging Still Not So Simple (Semiconductor Engineering; Jan. 8, 2018)

Packaging Challenges For 2018 (Semiconductor Engineering; Jan. 8, 2018 )

Packaging Articles: Archives

Purchase: Global Semiconductor Packaging Materials Outlook — 2015-2019


Upcoming Events

June 20-21FLEX Korea 2018
Sept 5-7SEMICON Taiwan
Sept 19-21European MEMS & Sensors Summit 2018
Sept 24-26Strategic Materials Conference 2018

Oct 28-30

MEMS & Sensors Executive Congress - MSEC 2018

Nov 4-7International Technology Partners Conference (ITPC) 2018
More Events 

New from SEMI: Packaging Report

Purchase the Global Semiconductor Packaging Materials Outlook — 2015-2019

Packaging Backgrounder

 Advanced Packaging Market Data from Yole Développement (January 2017)



SEMI provides both the forum and leadership so companies can confidently participate in an open, informed and professional environment on packaging issues.

Packaging activities are integrated with other SEMI programs, events, products, and initiatives. 


Get Involved