Industry News Archive Provided by SEMI

Industry News Archive

SEMI provides this archive of news and information from industry news sources as a resource. Due to the nature of dated material on the internet, SEMI does not guarantee that links are maintained by the news provider.

Blog Review: Jan. 18
(Semiconductor Engineering - 18 Jan 2017)

Extending the era of Moore’s Law through lower cost patterning »
(Silicon Semiconductor - 17 Jan 2017)

CEOs Rush to Avoid Trump’s Wrath With Stops at the Gilded Tower
(Bloomberg - 17 Jan 2017)

What Can Go Wrong In Automotive
(Semiconductor Engineering - 17 Jan 2017)

Manufacturing Bits: Jan. 17
(Semiconductor Engineering - 17 Jan 2017)

Commentary: A lesson to be learned from China panel industry headhunting
(Digitimes - 16 Jan 2017)

Outlook for 450 mm wafers fades »
(Silicon Semiconductor - 13 Jan 2017)

Fab investment surging in China, says SEMI
(Digitimes - 13 Jan 2017)

TSMC could build plant in the US, says Chang
(Digitimes - 12 Jan 2017)

SEMI ISS 2017 uncovers new growth, forecast upgrades
(Display Plus - 12 Jan 2017)

EDA in the year 2017 – Part 1
(Chip Design Blogs - 12 Jan 2017)

China Defends Big Chip Bet
(Electronic Engineering Times - 12 Jan 2017)

TSMC Expects Flat Year for Foundry
(Electronic Engineering Times - 11 Jan 2017)

China Expected to Poach More Taiwan Chip Execs
(Electronic Engineering Times - 11 Jan 2017)

SEMI ISS 2017 uncovers new growth, forecast upgrades
(Solid State Technology - Blog - 10 Jan 2017)

Semiconductor eyed for next-generation 'power electronics'
(Phys.org - 10 Jan 2017)

Manufacturing Bits: Jan. 10
(Semiconductor Engineering - 10 Jan 2017)

Blog Review: Jan. 4
(Semiconductor Engineering - 4 Jan 2017)

 

 

BRIEF-TSMC orders machinery equipment from Lam Research, Applied Materials
(Business News & Financial News - Reuters - 3 Jan 2017)

Printed Electronics Now’s Top 10 Online Exclusives for 2016
(Printed Electronics Now - 3 Jan 2017)

Chip Sales Grew Sharply in November
(Electronic Engineering Times - 3 Jan 2017)

Bloomberg’s Srinivasan: Move From China Could Harm Chip Makers
(Bloomberg - 3 Jan 2017)

TSMC 7nm ready for customer tape-outs in 2Q17, says report
(Digitimes - 3 Jan 2017)

Yangtze River Storage breaks ground for memory plant
(Digitimes - 2 Jan 2017)

Obama to Urge Protection for Chip Industry
(Electronic Engineering Times - 2 Jan 2017)

Intel Finds Moore’s Law’s Next Step at 10 Nanometers
(IEEE Spectrum - 30 Dec 2016)

LED Technology Breakthroughs in 2016
(LEDInside - 29 Dec 2016)

More Reactive, Less Warming
(Semiconductor Engineering - 29 Dec 2016)

China's Belt and Road initiative vital to Asian job creation
(Nikkei Asian Review - 28 Dec 2016)

IoT Ready to Light Up in 2017
(Electronic Engineering Times - 27 Dec 2016)

Toshio Maruyama of Advantest receives SEMI Marketing Excellence Award
(Digitimes - 27 Dec 2016)

Ten Best Chip CEOs 2016
(Mannerisms - Electronics Weekly Blog - 27 Dec 2016)

TSMC Says 10nm on Track, Countering Reports
(Electronic Engineering Times - 27 Dec 2016)

BRIEF-TSMC orders equipment from Wholetech System, Applied Materials, Tokyo Electron
(Business News & Financial News - Reuters - 26 Dec 2016)

Your Year in Review, Unsung Hero
(EE Times Blogs - 26 Dec 2016)

Samsung to Form QD TV Alliance
(LEDInside - 26 Dec 2016)

Japan Inc. Shows Its Savvy
(Bloomberg - 26 Dec 2016)

A year in review: Top 10 stories of 2016
(Solid State Technology - Blog - 23 Dec 2016)

Japan Is Developing a 'Hydrogen Society' in Mt. Fuji's Shadow
(Bloomberg - 22 Dec 2016)

Moore’s law and the impact on the raw material supply chain
(EMS Now - 22 Dec 2016)

Reflecting Back On 2016: Tools, Designs, Manufacturing
(Semiconductor Engineering - 22 Dec 2016)

Honey, I shrunk the circuit
(ScienceDaily - 21 Dec 2016)

Flexible and Printed Electronics in 2016: The Year in Review
(Printed Electronics Now - 21 Dec 2016)

Foundries See Mixed Future
(Semiconductor Engineering - 21 Dec 2016)

Blog Review: Dec. 21
(Semiconductor Engineering - 21 Dec 2016)

Wafer Works to set up 8-inch fab in China
(Digitimes - 20 Dec 2016)

Chips Execs See Maturing Industry
(Electronic Engineering Times - 20 Dec 2016)

62 new facilities start operation 2017 and beyond
(Solid State Technology - Blog - 19 Dec 2016)

Toshio Maruyama to Receive SEMI Marketing Excellence Award at SEMICON Japan
(EMS Now - 19 Dec 2016)

China’s Memory Drama: Must-See in 2017
(Electronic Engineering Times - 19 Dec 2016)

Uncertainty Grows For 5nm, 3nm
(Semiconductor Engineering - 19 Dec 2016)

China Dominates Planned Chip Fabs
(Electronic Engineering Times - 15 Dec 2016)

Fab Tool Biz Faces Challenges In 2017
(Semiconductor Engineering - 15 Dec 2016)

Inside Advanced Patterning
(Semiconductor Engineering - 15 Dec 2016)

New fab facilities: China dominates, followed by Americas and Taiwan
(Solid State Technology - 14 Dec 2016)

SEMICON China 2017 presents six forums in China’s explosive growth market
(Solid State Technology - 14 Dec 2016)

New Fab Facilities: China Dominates, Followed by Americas and Taiwan
(EMS Now - 14 Dec 2016)

Globalfoundries demoes finfet silicon running at 56Gbit
(Electronics Weekly - 13 Dec 2016)

Semiconductor Equipment Sales Forecast - $40 Billion
(EMS Now - 13 Dec 2016)

Manufacturing Bits: Dec. 13
(Semiconductor Engineering - 13 Dec 2016)

Chip manufacturing equipment market grows 8.7%
(Electronics Weekly - 13 Dec 2016)

TSMC plans 3/5nm fab for 2022
(Electronics Weekly - 12 Dec 2016)

Commentary: Silicon wafer industry headed for consolidation
(Digitimes - 12 Dec 2016)

Engineers integrate internal robotic tactile sensors
(Phys.org - 12 Dec 2016)

China Eyes Chip Market Amid Growing Demand
(Forbes.com - 9 Dec 2016)

Chinese firm scraps German tech deal after US block
(Phys.org - 8 Dec 2016)

A stamp to print electronic inks
(New Electronics - 8 Dec 2016)

What Comes After Moore’s Law And Dennard Scaling?
(Semiconductor Engineering - 8 Dec 2016)

Reflecting Back on 2016: Markets
(Semiconductor Engineering - 8 Dec 2016)

Five suppliers to hold 41% of global semiconductor marketshare in 2016
(Solid State Technology - 7 Dec 2016)

Qualcomm Launches The First 10nm Server Chip
(Forbes.com - 7 Dec 2016)

ClassOne reports record sales, driven by wafer-level packaging and More than Moore technologies
(Semiconductor Today - 7 Dec 2016)

Blog Review: Dec. 7
(Semiconductor Engineering - 7 Dec 2016)

TSMC to build new plant for 5nm and newer processes
(Digitimes - 6 Dec 2016)

Brewer Science unveils temporary wafer bonding technology for advanced packaging
(Display Plus - 6 Dec 2016)

Why China Wants U.S. Memory Chip Technology -- And What Washington Is Doing About It
(Forbes.com - 6 Dec 2016)

Semiconductor Materials: Restructuring in the Supplier Base
(Semiconductor Manufacturing & Design - 6 Dec 2016)

TSMC, IBM Detail 7-nm Work
(Electronic Engineering Times - 6 Dec 2016)

Fabless Industry Shrinks
(Electronics Weekly - 6 Dec 2016)

Global 3Q16 semiconductor equipment billings rise, says SEMI
(Digitimes - 6 Dec 2016)

Manufacturing Bits: Dec. 6
(Semiconductor Engineering - 6 Dec 2016)

China holds mantle of Asia's technology, science power
(Nikkei Asian Review - 6 Dec 2016)

Lawmakers Urge Rejection of Lattice Semi Takeover
(Electronic Engineering Times - 5 Dec 2016)

Taiwan leads semiconductor equipment purchases
(Electronics Weekly - 5 Dec 2016)

China to US: Avoid politics in purchase of Germany's Aixtron
(Phys.org - 2 Dec 2016)

TSMC lands new 28nm chip orders for UFS controllers
(Digitimes - 2 Dec 2016)

Obama Said Poised to Block Chinese Takeover of Germany’s Aixtron
(Bloomberg - 1 Dec 2016)

Third Time Could Be The Charm For Silicon Valley And Japan
(Forbes.com - 1 Dec 2016)

RISC-V Expands its Audience
(Electronic Engineering Times - 1 Dec 2016)

IoT, Architectures, And Security
(Semiconductor Engineering - 1 Dec 2016)

2016 News Archive

2015 News Archive

2014 News Archive

2013 News Archive

2012 News Archive

2011 News Archive