Mr. Nelson Fan
Vice President of Business Development for Advanced Packaging Technologies
ASM Pacific Technology
Mr. Nelson Fan has been serving the semiconductor industry for more than 20 years, who is now the VP of Business Development for Advanced Packaging Technology in ASMPT. Previously he had been a company Co-Founder and VP of Engineering for a company offering thermal cooling solution, and before that he was the GM and VP of package development of an OSAT in Hong Kong. Fan holds more than 40 U.S. patents in semiconductor packaging technologies.