Mr. Farhang Yazdani
President & CEO
Mr. Farhang Yazdani is the President and CEO of BroadPak Corporation, providing total solution and technologies to develop and launch secured 2.5D/3D products. Through his 17 years with the industry, he has served in various technical, management, and advisory positions with leading semiconductor companies worldwide. He has numerous publications and IPs in the area of Packaging and Assembly, serves on various technical committees and is a frequent reviewer for IEEE Journal of Advanced Packaging. He received his undergraduate and graduate degrees in Chemical Engineering and Mechanical Engineering from the University of Washington, Seattle. He is a member of AICHE, ASME, IEEE, IMAPS, SPE and the Society of Rheology.