Advanced Packaging Technologies for IoT and Other Applications

Security Requirements for Advanced Packaging

Demand for miniaturization and heterogeneous integration in various markets and applications including IoT, MEMS and 3DIC has pushed the packaging industry to transform from a passive mechanical platform to more of an intelligent platform. Since the IC design, manufacturing and packaging is heavily outsourced, the threats of security breaches are imminent. Slipping a malicious component or interposer into the 3DIC, MEMS or IOT assembly has never been easier. This talk describes the requirements and the security threats that the packaging industry is facing.