Security Requirements for Advanced Packaging
Demand for miniaturization and heterogeneous integration in various markets and applications including IoT, MEMS and 3DIC has pushed the packaging industry to transform from a passive mechanical platform to more of an intelligent platform. Since the IC design, manufacturing and packaging is heavily outsourced, the threats of security breaches are imminent. Slipping a malicious component or interposer into the 3DIC, MEMS or IOT assembly has never been easier. This talk describes the requirements and the security threats that the packaging industry is facing.