Material & Process Technologies for Manufacturing of MEMS in The Era of IoT
Accelerometers, Gyroscopes, RF Filters and the Digital Compass are but a few of the devices enabled through advances in MEMS design and process capability. While the number of device types continues to grow so do the short cycle generational pressures of device size (footprint), capability and cost. This presentation will explore a number of new material technologies that are enabling device manufacturers to build MEMS devices that meet the performance and size demands of the booming MEMS device market. In doing so, this presentation will also provide an update on the development of a number of new and existing advanced technologies for MEMS, such as Deep Reactive Ion Etch (DRIE), High Uniformity Aluminum Nitride (AlN), Low Temperature Silicon Germanium (SiGe) and Thick Epitaxial Silicon (Thick-Epi) growth, among others. Finally, the presentation will conclude with a discussion on how new concepts and trends such as Internet-of-Things (IoT) may challenge both the capability and price competitiveness of the current 200mm equipment landscape. How will this new trend affect the future of the 200mm equipment market? What new challenges and opportunities does it present?