Mr. Charles Lee
Senior Technical Manager
Charles Lee has over 20 years of experience in the semiconductor industry. He is currently Senior Technical Manager at ASE Europe and is responsible for driving automotive and power electronics packaging initiatives. He received the M.App.Sc degree in Materials Science and Engineering from the University of New South Wales, Australia in 1993.
Before joining ASE, he was Director of Strategic Marketing at the Institute of Microelectronics (IME) - a national research institute of the Agency for Science, Technology and Research (A*STAR) in Singapore, from 2007-2009. His role was to promote and establish joint developments and research collaborations in areas of circuit design, semiconductor process technology, microsystems packaging (multi-functional system integration), bioelectronics, nanoelectronics, photonics, and MEMS leading to industrial applications.
Charles began his career with Siemens Components Pte Ltd, Singapore (now Infineon Technologies Asia Pacific Pte Ltd) in 1993 as a Package Development Engineer. He held several functions spanning from spearheading research development to technology management over a period of 13 years with Siemens/Infineon. He was awarded the Regional Siemens 150 Years Innovation Award in 1997 and was promoted in 2001 to the position of Principal, Materials Science and Technology Integration, in recognition for his technical leadership and contributions. He was widely recognised for his pioneering work and successful implementation of a novel inorganic adhesion system for robust automotive and lead-free applications. In 2000, he was appointed by IME to lead an industry Electronic Package Research Consortium to develop a high performance System-in-Package.
Charles is a Senior IEEE member and a recipient of the 2001 IEEE/CPMT Society Outstanding Young Engineer Award. He has more than 60 publications in international conferences and peer-reviewed journals and more than 10 patents in electronic packaging technologies. He has been an active volunteer for IEEE and various conference committees for more than a decade. He was IEEE/CPMT Society Region 10 (Asia Pacific) Strategic Program Director from 2006-2010 and an elected member of the Board-of-Governors from 2004-2006 and 2013-2015. He was also an executive committee member of the Singapore IEEE REL/CPMT/ED Chapter from 2000-2010. Since the inauguration of the Electronic Packaging Technology Conference (EPTC) in 1997, he has served in various roles: EPTC Board Chairman (2010-2011), EPTC Board Member (2005-present), EPTC General Chairman (2002) and EPTC Technical Chairman (2000). He was also a member of the Interconnect program committee of the Electronic Components and Technology Conference from 2002-2010.