Innovative SiP Technology for IoT and Wearable Devices

Innovative SiP Technology for IoT and Wearable Devices

The Internet of Things (IoT) is a scenario in which objects, animals or people are provided with unique identifiers and the ability to transfer data over a network without requiring human-to-human or human-to-computer interaction. IoT has evolved from the convergence of wireless technologies, micro-electromechanical systems (MEMS) and the Internet. In other words, with the Internet of Things, the physical world is becoming one big information system.

Analysts have predicted that the installed base for IoT devices will grow from around 10 billion connected devices today to as many as 30 billion devices by 2020. Each of these devices will require, at a minimum, a microcontroller to add intelligence to the device, one or more sensors to allow for data collection, one or more chips to allow for connectivity and data transmission, and a memory component. For semiconductor players, this represents a direct growth opportunity that goes beyond almost all other recent innovations—with the exception, perhaps, of the smartphone.

Semiconductor device manufacturers are constantly confronted with device integration challenges as consumers want electronics to be smaller, more portable and more multi-functional than ever. Engineers have answered the challenge with system-on-a-chip (SoC) and system-in-a-package (SiP) technologies. The choice between SoC and SiP often creates a debate among RF designers because both approaches provide different advantages for different end-market applications. Although SoCs provide the lowest manufacturing cost, design costs are often higher and time-to-market is generally slower. SiPs, on the other hand, allow for relatively easy hetero-integration of analog and RF functionalities with digital CMOS, with possible cost and performance benefits. However, proper system partitioning at the design stage is key to obtaining the maximum value from a SiP.

In this presentation, we will discuss the use of innovative SiP technologies to enable low cost IoT and wearable devices.