Jerome Teysseyre has a Master degree in Material Sciences from Grenoble University France. He has 15 years of experience in Package development and he is based in Singapore for 5 years since 2010.
He holds a position of Director, Corporate Packaging and Automation at STMicroelectronics before he joins Fairchild at the end of 2014 as VP Assembly technology and Package development.
He has experienced in:
- New package platform development for consumer, industrial, automotive and defense markets. (BGA, System In Package, Wafer level packaging, Camera module, Sensors, Discrete, power modules, Leadframe based smartpower packages)
- Enabling technology development and introduction to production (Interconnect evolution Flip chip, gold to copper, miniaturization and integration 2D, 2.5D)