Powering the Internet Of Things (IoT)
IoT is all about sensing and connecting things. The market has been significantly growing and opening more and more opportunities in consumer space with wearables, industrial and automotive applications. Companies are then facing challenges to provide products with the right level of performances, quality and at the right cost. Starting with MEM’s, die to package interactions are keys. It leads companies to define new approaches and provide solution to reduce parasitic effects. Several packaging solutions can be used and will be selected as function of applications needs. FEA models have been developed and being used as key prediction tool.
Power management is a challenge - This can be related to battery charging, power consumption in cloud storage, MEM's with low power consumption/high accuracy and so-on. Packages used for power management needed some evolution as we want our products to operate longer, with better efficiency. Such requirements are pushing the limits of design rules and migration of interconnect type.
Fairchild is working on total solutions (Silicon and Packaging) driving miniaturization - integration - performances and cost. Examples of package evolution in the field of MEM’s, QFN’s and Wafer level CSP will be shared.