System-Scaling and Integration Platforms for IoT
The Internet of Things (IoT) will lead to unprecedented demands in terms of data-traffic. Data-sharing networks need to be capable of storing and transmitting large amount of data as well as perform smart data-analysis to enable timely planning and decision-making in both personal (e.g. social, health) and enterprise (e.g. business, factory, traffic management) settings. To handle rapidly increasing amount of data, microelectronic devices and the interconnects between the vast number of devices within smaller systems (e.g. wearables, mobile phones, implanted devices) and larger systems (cars, factory equipment, roads and bridges, supercomputers etc.) need to continuously scale with each successive generations. Moore’s law enables device scaling. Advanced interconnects and packaging technologies enable system-scaling. In this presentation, recent developments in interconnects and packaging technologies that will enable IoT will be presented. Some of these technologies include high density fan-out wafer Level packaging, passive and active interposers, high throughput chip-on-wafer bonding, as well as wafer level chip scale packaging for MEMS and sensors.