Ms. Rozalia Beica
Chief Technology Officer
Rozalia has 24 years of experience across various industries, from industrial to electronics and semiconductors. For more than 17 years, she was involved in the research, application and strategic marketing of Advanced Packaging and 3D Interconnect, with global leading responsibilities at specialty materials (Rohm and Haas Electronic Materials), equipment (Semitool, Applied Materials, Lam Research), device manufacturing (Maxim IC) and OEM (NCR) organizations. In 2013 she joined Yole Developpement to lead and further grow the Advanced Packaging and Semiconductor Manufacturing activities within Yole.
Throughout her career, Rozalia has been very actively supporting various industry activities: Program Director of EMC3D Consortia, chair of several 3D Committees and activities (ITRS, ECTC, IMAPS DPC), chair Advanced Packaging Committee at ECTC, IMAPS DPC General Chair, Global Semiconductor and Electronics Forum General Chair and several additional memberships with SRC IPC, CPMT, SEMI, IWLPC, EMPC, EPTC, 3DIC committees. She has won several awards, including 2006 R&D 100 international award for Electrodeposition of SnAgCu wafer bumping, 2013 IE Business School Entrepreneurship Project of the Year and winning project at Fudan University Venture Day in Shanghai for developing affordable renewable energy solutions to address rural electrification in Africa and Dale Carnegie's "The Highest Achievement Award". She has over 60 publications (including 3 book chapters focused on 3D IC technologies), several keynotes and panel participations, and four patents. Rozalia has a Global Executive MBA from Instituto de Empresa Business School (Spain), M. Sc. In Management of Technology from KW University (USA) and an M.Sc in Chemical Engineering from Polytechnic University "Traian Vuia" (Romania).