The Growth of Advanced Packaging; What Makes it so Special?
The semiconductor industry has followed Moore's law for several decades, scaling the CMOS technology to smaller and more advanced technology nodes while, at the same time, reducing the cost. The industry is reaching now limitations in continuing this scaling process in a cost effective way. While technology nodes continue to be developed and innovative solutions are being proposed, the investment required to bring such technologies to production are significantly increasing. A paradigm shift has been created in the industry where new opportunities for continuing to increase performance while addressing the need for more functionalities and reduced cost can be achieved through advanced packaging, reason why, the interest in Advanced Packaging has significantly grown in the past couple of years. Today, several different packaging technologies are available in the industry: from encapsulation based technologies for MEMS and sensors, to fan-in and embedded technologies either in a mold or laminate, flip chip bumping and 3D packaging using stacked devices and through-silicon-via interconnect technologies. The suitability of each of these platforms and market adoption will depend on the final product and application needs. This talk will provide an overview of current trends seen in the industry across all the packaging platforms, main applications and needs driving the growth of packaging, highlighting challenges and advancements with mature, already established technologies and markets and new requirements and activities taken place to support newer applications such as IoT.