Foundry Perspective - Trends and Challenges in Volume Manufacturing of MEMS for IoT Applications

Foundry Perspective - Trends and Challenges in Volume Manufacturing of MEMS for IoT Applications

Internet of Things (IoT) is expected to change the way we interact and communicate with objects all around us and how objects interact with each other creating intelligent or smart systems. Sensors form the front end of the IoT technology.  A vast majority of sensors, both existing and emerging, are expected to use MEMS technology for the IoT applications. The timely and cost effective availability of such sensors is, therefore, one of the key requirements for the success of the IoT technology and proliferation of its applications.

MEMS sensors are quite diverse from design, process, packaging and testing considerations. Thus, there is a need to bring in some form of standardization in manufacturing and usage of these sensors to enable large scale manufacturing. At the same time new sensors will be required to meet the new functionality, power, form factor and overall integration needs for the IoT applications. MEMS foundries thus face the challenges of bringing in the standardization in manufacturing process, integration of new materials, wafer level testing and packaging for expanding the manufacturing base for existing sensors as well as reducing development time and costs for the emerging sensors. This talk will highlight such challenges faced by MEMS foundries and strategies to overcome these challenges.