Mr. Damo Srinivas
Managing Director Advanced Packaging
Lam Research Corporation
Damo Srinivas rejoined Novellus Systems Inc. in April 2010 and is currently Managing Director of Business Development for the Lam Research equipment portfolio serving the advanced wafer level packaging applications & FEOL Electroplating. Damo has held several key management positions including Vice President, General Manager for the Photoresist and CMP business groups at Novellus and Vice President, Interconnect Technologies at ATMI Inc.
Damo has also extensive international customer experience working in account management roles for Novellus serving Intel in Hillsboro, OR for 6 years , IBM and alliance partners for 2 years based in Fishkill, NY and 2 years in Hsinchu, Taiwan R.O.C., serving TSMC, UMC, and the rest of the Semiconductor companies based in Taiwan, China and Singapore.
Damo also has extensive product management and business development experience and has led several new product development for high end value added Semiconductor applications. Damo received his M.S. Degree in Materials Science from Arizona State University, Tempe, AZ USA and B.S. Degree in Metallurgical Engineering from Indian Institute of Technology, Chennai, India.