Technology Enabled Productivity Solutions for Advanced Packaging
The adoption of TSV has been limited to a few niche applications due to the high costs of TSV integrated process. In this presentation, we will propose a novel Barrier/Seed scheme that will significantly lower the costs of barrier/seed deposition and reduce the CMP costs due to improved step coverage. The bump electroplating processes in wafer level packaging are very cost driven and require innovations to improve the on wafer performance without compromising the capital productivity. We will present a few technology innovations such as LAM’s Turbocell™ technology, Dynamic Edge tuning (DET) that has proven to improve the on wafer performance and wafer yields while improving the capital productivity and lowering the overall cost of ownership for the integrated processes.