SEMI Southeast Asia: Advanced Semiconductor Technology Conference Agenda

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MEMS and Packaging Technologies Enabling IoT              

 

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27-28 July, 2015
Marina Bay Sands
Begonia Ballroom, Level 3
Singapore

Agenda

Day One - Monday, 27 July

Theme: MEMS Sensors and Technologies for IoT

08:00-09:00         Registration
09:00-09:05                  Dr. Alex Gu  Welcome Remarks/Introduction by Session Chair
Dr. Alex GU (biography), Programs Director of Sensors, Actuators, and Microsystems Program & Miniaturised Medical Devices Program
A*STAR Institute of Microelectronics (IME) 
  
09:05-09:40  Mr. Ng Kai Fai SEMI Market Update and Outlook
Mr. Kai Fai NG, President
SEMI Southeast Asia

[PRESENTATION] PDF 940Kb  
  
09:40-10:15
Mr Jean-Christophe Eloy
 From Niche Applications to a Connected World, a Half-Century MEMS Story!
Mr. Jean-Christophe ELOY (biography), President & CEO
Yole Développement

[PRESENTATION] PDF 3.4Mb  
  
10:15-10:35Coffee/Tea Break (Begonia Foyer, Level 3)  
 
10:35-11:10Mr. Quor Hahn LEONG
Material & Process Technologies for Manufacturing of MEMS in The Era of IoT
Mr. Quor Hahn LEONG (biography)
, Global Product Manager
Applied Materials

[PRESENTATION] PDF 2.5Mb 
  
11:10-11:45 
Dr. Alex Gu
 Optical Chemical Sensing Platform for Environmental Applications 
Dr. Alex GU (biography), Programs Director of Sensors, Actuators, and Microsystems Program & Miniaturised Medical Devices Program
A*STAR Institute of Microelectronics (IME) 

[PRESENTATION] PDF 2.0Mb 
    
11:45-12:20Mr. Benjamin Tan
 A New Ecosystem: Smarter and Connected Vehicles and Automotive IoT
Mr. Benjamin TAN (biography)
, Director of Marketing and BD, Asia Freescale Analog and Sensors Group
Freescale Semiconductor 

[PRESENTATION] PDF 1.4Mb 
   
12:20-13:30 Buffet Lunch (Begonia Ballroom, Level 3) 
  
13:30-14:05Dr Rakesh Kumar
 Foundry Perspective - Trends and Challenges in Volume Manufacturing of MEMS for IoT Applications
Dr. Rakesh KUMAR (biography), Senior Director of MEMS Technology Development
Globalfoundries Singapore

[PRESENTATION] PDF 2.2Mb
    
14:05-14:40Mr. Danial Mausoof
 Internet of Things and how we manage the Complexity of Networks
Mr. Danial MAUSOOF (biography), 
Head of Marketing and Corporate Affairs for Asia Pacific and Japan
Nokia

[PRESENTATION] PDF 816Kb
  
 
14:40-15:15Dr. John H. Lau
 SiPs for Internet of Things – 3D CIS/IC and MEMS/IC Integration
Dr. John H. LAU (biography), Senior Technical Advisor
ASM Pacific Technology

[PRESENTATION] PDF 1.4Mb
   
15:15-15:35 Coffee/Tea Break (Begonia Foyer, Level 3)
 
15:35-16:10Ms Janice Deceline Printed, Flexible, and Organic Sensors in the Internet of Things (IoT)
Ms. Janice DECELINE (biography), Consultant
Lux Research

[PRESENTATION] PDF 1.3Mb
   
16:10-16:45Mr. Andy Dong
 Textile-Integrated Biometric Sensor in Wearable Wave
Mr. Andy DONG (biography)
 , Sales & Marketing Manager
ClothingPlus

[PRESENTATION] PDF 1.6Mb


16:45-17:30 Panel Discussion: "Future of IoT: In Search of Killer Applications and Associated Technology Needs."

Moderator: Dr. Alex GU, Programs Director of Sensors, Actuators, and Microsystems Program & Miniaturised Medical Devices Program, A*STAR Institute of Microelectronics (IME)

Panelist:
  • Mr. Jean-Christophe ELOY, President & CEO, Yole Développement
  • Mr. Benjamin TAN, Director of Marketing and BD, Asia Freescale Analog and Sensors Group, Freescale Semiconductor
  • Ms. Janice DECELINE, Consultant, Lux Research
  • Mr. Andy DONG, Sales & Marketing Manager, ClothingPlus
  
17:30-17:35Dr. Alex Gu Closing Remarks by Session Chair 
Dr. Alex GU (biography), Programs Director of Sensors, Actuators, and Microsystems Program & Miniaturised Medical Devices Program
A*STAR Institute of Microelectronics (IME)
 
17:35-19:30 Networking Cocktail (Agenda)
Cassia Ballroom, Level 3 
  

Day Two - Tuesday, 28 July

Theme: Advanced Packaging Technologies for IoT and Other Applications

08:00-09:00 Registration
 
09:00-09:05Dr. Surya Bhattacharya
 Welcome Remarks/Introduction by Session Chair
Dr. Surya BHATTACHARYA (biography)
, Director of Industry Development (2.5D / 3D ICs)
A*STAR Institute of Microelectronics (IME)
 
09:05-09:35Ms Rozalia Beica The Growth of Advanced Packaging; What Makes it so Special?
Ms. Rozalia BEICA (biography), Chief Technology Officer
Yole Développement 

[PRESENTATION] PDF 5.2Mb






 
 
09:35-10:05Mr. _John Galang
Internet of Everything - Next Generation Supply Chain Eco-system
Mr. John GALANG 
(biography), Regional Director, SEA, Global Manufacturing Operations
Cisco Systems, Penang
  
10:05-10:35Mr. Farhang YazdaniSecurity Requirements for Advanced Packaging
Mr. Farhang YAZDANI (biography), President & CEO
BroadPak Corporation
 
10:35-10:55 Coffee/Tea Break (Begonia Foyer, Level 3)
  
10:55-11:25Mr Jerome Teysseyre Powering the Internet Of Things (IoT)
Mr. Jerome TEYSSEYRE (biography)
, Vice President, Assembly Technology and Package Development
Fairchild

[PRESENTATION] PDF 1.3Mb 
 
 
11:25-11:55Enabling Material Solutions for Advanced Electronics Packaging
Dr. Yan SHA (biography)
, Global Product Director
Dow Chemical 
 
11:55-12:25Mr. Damo Srinivas Image Technology Enabled Productivity Solutions for Advanced Packaging
Mr. Damo SRINIVAS (biography)
, Managing Director Advanced Packaging
Lam Research Corporation
 
12:25-13:35 Buffet Lunch (Begonia Ballroom, Level 3) 
 
13:35-14:05Dr. Surya Bhattacharya
 System-Scaling and Integration Platforms for IoT
Dr. Surya BHATTACHARYA (biography)
, Director of Industry Development (2.5D / 3D ICs)
A*STAR Institute of Microelectronics (IME)

[PRESENTATION] PDF 4.2Mb  
 
14:05-14:35Mr. Cliff Sandstrom
 Embedded Chip Wafer Level Fan-Out Technology
Mr. Cliff SANDSTROM
(biography), Senior Technical Director
Deca Technologies

[PRESENTATION] PDF 2.7Mb 
 
14:35-15:05Mr. Nelson Fan
 Innovative High Throughput TCB Process
Mr. Nelson FAN (biography)
, Vice President of Business Development-Advanced Packaging Technologies
ASM Pacific Technology

[PRESENTATION] PDF 1.8Mb 
 
15:05-15:25 Coffee/Tea Break (Begonia Foyer, Level 3)
  
15:25-15:55Dr. Piotr Kropelnicki
 Optical and Infrared MEMS Sensors and Packaging Challenges for IoT and Other Applications
Dr. Piotr KROPELNICKI (biography), 
Principal Engineer 
Excelitas Technologies

[PRESENTATION] PDF 3.2Mb  
 
15:55-16:25Mr. Charles LEE Innovative SiP Technology for loT and Wearable Devices
Mr. Charles LEE (biography)
, Senior Technical Manager
ASE Group 
 
16:25-17:10

Panel Discussion: "What Innovations will IoT Drive in Advanced Packaging?"

Moderator: Ms. Rozalia BEICA, Chief Technology Officer, Yole Développement

Panelist:
• Dr. Surya BHATTACHARYA, Director of Industry Development (2.5D / 3D ICs), A*STAR Institute of Microelectronics (IME)
• Mr. Farhang YAZDANI, President & CEO, BroadPak Corporation
 Mr. Jerome TEYSSEYRE, Vice President, Assembly Technology and Package Development, Fairchild
• Mr. Cliff SANDSTROM, Senior Director R&D, Deca Technologies
• Dr. Piotr KROPELNICKI, Principal Engineer, Excelitas Technologies
• Mr. Damo SRINIVAS, Managing Director Advanced Packaging, Lam Research Corporation 

 
17:10-17:15Dr. Surya Bhattacharya
 Closing Remarks by Session Chair
Dr. Surya BHATTACHARYA (biography), Director of Industry Development (2.5D / 3D ICs)
A*STAR Institute of Microelectronics (IME)
 

Diamond Sponsors:

Sponsors:


 Lam logoASM Logo
KLA-Tencor LogoKandS Logo

For more Sponsorship information, contact:

Ms. Shannen Koh
SEMI Singapore
Email: skoh@semi.org

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