SEMI Southeast Asia: Advanced Semiconductor Technology Conference

ASTC logo

Advanced Semiconductor Technology Conference 2015

27-28 July, 2015
Marina Bay Sands
Begonia Ballroom, Level 3

SEMI Southeast Asia is please to present the first Advanced Semiconductor Technology Conference (ASTC) to be held at the Marina Bay Sands in Singapore.

ASTC is designed to serve the Southeast Asia semiconductor industry through the sharing of information focused on the development of technology innovations advancing semiconductor design and manufacturing.

For 2015, SEMI has partnered with the Institute of Microelectronics (IME) and Yole Développement on the conference theme MEMS and Packaging Technologies Enabling IoT


Analysts worldwide believe technologies comprising the Internet of Things (IoT) will be the next growth driver for the semiconductor industry, creating strong demand for highly connected and power efficient devices (or “smart nodes”) that will enable seamless, automated data sensing and communication between devices. Popular projections estimate that there will be more than 50 billion connected devices worldwide by 2020, while other more optimistic forecasts think this number will be in the trillions. Regardless of number, the explosive demand for connected devices and the expectations for their performance is driving a need to integrate diverse technologies including sensors, wireless radios, energy harvesting, and microcontrollers (MCUs) for rapid and cost-effective deployment across a broad spectrum of smart applications such as smart homes, smart cities, wearables, and health care.

The Advanced Semiconductor Technology Conference will bring together industry experts and professionals with expertise in MEMS, sensors, and advanced packaging technologies to share their insights on these and related emerging trends, applications, and technologies enabling the IoT future.

Who Should Attend

  • High-level professionals specializing in the advance of MEMS and sensor adoption, as well as those involved in advanced packaging, integration, and commercialization

  • Research and Development specialists

  • Academics



The program will provide industry insights on IoT, including market trends and applications for consumer and industry. It will address the requirements of IoT for innovative technology development in power management and MEMS energy harvesting, RF communications and multiple standards integration, sensors & sensors interface for remote monitoring, memory, as well as semiconductor manufacturing, including plastic electronics. Also, focusing on system integration. In particular, packaging technologies such as fan-out wafer level packaging, 3D integration, heterogeneous integration, that can enable economically efficient integrated circuits addressing high functionality and performance, low cost, small footprint and ultra-low power consumption. Packaging technologies and challenges for high power, high frequency applications and RF integrated circuits, will also be discussed.


Networking Reception

This session provides the interaction of delegates with our invited speakers and industry veterans under a relaxing and conducive setting. A great way to expand your knowledge, learn and share the success stories, attain new opportunities and connections through the valuable networking reception.

Conference and Sponsorship Questions

Ms. Shannen Koh


Delegate Fee

SEMI Member:
SGD 650 per pax

SGD 800 per pax

*15% discount for Singapore Citizen/Permanent Resident
Register NOW! 


Complimentary Networking Reception for all delegates for the first year!


Info on Hotel Accommodation


Diamond Sponsor:

Lam logo


ASM Logo


KLA-Tencor Logo


KandS Logo


Supporting Partners:

IME logo

Yole logo

WDA Logo

WDA Step Logo

Organized by:

SEMI logo