Advanced Semiconductor Technology Conference 2015
27-28 July, 2015
Marina Bay Sands
Begonia Ballroom, Level 3
SEMI Southeast Asia is please to present the first Advanced Semiconductor Technology Conference (ASTC) to be held at the Marina Bay Sands in Singapore.
ASTC is designed to serve the Southeast Asia semiconductor industry through the sharing of information focused on the development of technology innovations advancing semiconductor design and manufacturing.
For 2015, SEMI has partnered with the Institute of Microelectronics (IME) and Yole Développement on the conference theme MEMS and Packaging Technologies Enabling IoT.
Analysts worldwide believe technologies comprising the
Internet of Things (IoT) will be the next growth driver for the semiconductor
industry, creating strong demand for highly connected and power efficient
devices (or “smart nodes”) that will enable seamless, automated data sensing
and communication between devices. Popular projections estimate that there will
be more than 50 billion connected devices worldwide by 2020, while other more
optimistic forecasts think this number will be in the trillions. Regardless of
number, the explosive demand for connected devices and the expectations for
their performance is driving a need to integrate diverse technologies including
sensors, wireless radios, energy harvesting, and microcontrollers (MCUs) for
rapid and cost-effective deployment across a broad spectrum of smart
applications such as smart homes, smart cities, wearables, and health care.
The Advanced Semiconductor Technology Conference will bring
together industry experts and professionals with expertise in MEMS, sensors,
and advanced packaging technologies to share their insights on these and
related emerging trends, applications, and technologies enabling the IoT
Who Should Attend
High-level professionals specializing in the advance of MEMS and sensor adoption, as well as those involved in advanced packaging, integration, and commercialization
Research and Development specialists
The program will provide industry insights on IoT, including
market trends and applications for consumer and industry. It will address the
requirements of IoT for innovative technology development in power management
and MEMS energy harvesting, RF communications and multiple standards
integration, sensors & sensors interface for remote monitoring, memory, as
well as semiconductor manufacturing, including plastic electronics. Also, focusing on system integration. In particular, packaging technologies
such as fan-out wafer level packaging, 3D integration, heterogeneous
integration, that can enable economically efficient integrated circuits
addressing high functionality and performance, low cost, small footprint and
ultra-low power consumption. Packaging technologies and challenges for high
power, high frequency applications and RF integrated circuits, will also be
This session provides the interaction of delegates with our
invited speakers and industry veterans under a relaxing and conducive setting.
A great way to expand your knowledge, learn and share the success stories,
attain new opportunities and connections through the valuable networking
Conference and Sponsorship Questions
Ms. Shannen Koh
SGD 650 per pax
SGD 800 per pax
*15% discount for Singapore Citizen/Permanent Resident
REGISTRATION IS CLOSED.
Complimentary Networking Reception for all delegates for the first year!
Info on Hotel Accommodation