SMC 2014 Speaker - Suresh Upadhyayula - Abstract
Senior Director, Packaging Engineering
Materials challenges in advanced Flash memory packaging
Advanced NAND die stack requirements are driving ever thinner and thinner packages. The objective will be to highlight the ensuing materials and process selection trying to solve the thermal budget constraints during assembly, as well as to choose the right materials set to ensure the product life expectancy with respect to quality and reliability.
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