Director of Engineering, System Group
ASE (US) Inc.
Thin Packaging Technologies
The rapid proliferation of mobile, wearable and IOT products is driving the functional integration and form factor of semiconductor packaging solutions. Alongside, there is also growing need for differentiated SiP and module solutions to enable system integration, miniaturization, and cost reduction. During her presentation, Ou Li will explore assembly technology and material challenges in thin package and module products, as well as discuss the trend for next generation materials.