Leader, Package Architecture and Customer Technology
Rama Alapati is leading the Package Architecture and Customer Technology group focused on delivering package differentiated solutions. Rama led the 3D TSV technology startup in GLOBALFOUNDRIES Fab 8 for sub-20nm nodes. He was also responsible for Sub-20nm CPI qualification until recently. Rama represents GLOBALFOUNDRIES in consortia like imec, SRC and SEMATECH to drive packaging focused research programs. Prior to joining GLOBALFOUNDRIES, Rama was with Micron Technology for 8 years first as an etch engineer focused on pitch doubling technology for sub-50nm NAND and later on as a assignee at imec focusing on 3D-IC and BEoL integration.
Rama graduated with Master of Science (Honors) in chemical engineering from the University of Kansas, Lawrence and prior to that received his Bachelor of Technology degree with distinction from Osmania University in Hyderabad, India.