SEMI North America Standards HB-LED Activities Update

SEMI North America Standards HB-LED Activities Update

By Michael Tran, SEMI Americas

The SEMI North America Standards HB-LED Technical Committee (TC) Chapter has published several new documents in the latter half of 2013. 


SEMI HB3 defines the basic interface dimensions of a load port for 150 mm HB-LED Cassettes while SEMI HB4 provides a basis for a communication interface to enable a factory to control and monitor HB-LED manufacturing equipment. Both standards are available for purchase in the SEMI Store and through online access to SEMI Standards at SEMIViews.

During the most recent SEMI North America HB-LED TC Chapter meeting on February 25, 2014, Document 5684 to revise SEMI HB1 was approved by the TC Chapter. Document 5684 focused on changing the laser mark to include the front and backside of the sapphire wafers. In addition, the description of the front and backside roughness of the sapphire wafer was finalized. The document passed additional procedural review and is now pending publication.

The SEMI North America TC Chapter also discussed current and new activities of note:

  • HB-LED Wafer Marking Experiment Project
  • HB-LED Impurities and Defects
  • Double Sided Polished (DSP) Wafers
  • Patterned Sapphire Substrate (PSS)
  • Future SEMI HB1 Revisions
  • Possible new HB-LED related activities

The SEMI North America HB-LED Task Forces and TC Chapter meetings will reconvene on July 9 and 10, 2014 at the San Francisco Marriot Marquis Hotel during SEMICON West 2014. For more information, please visit:

Get Involved

If you are interested in participating in SEMI HB-LED standards activities or would like more information on the SEMI International Standards Program, please contact SEMI at

SEMI, Standards Watch - June 2014