William Miller is currently employed at Qualcomm where he is Vice President of Engineering with responsibility for failure analysis, test chip development, and yields of Qualcomm’s chip sets. Bill has over 35 years in the semiconductor industry with experience in all aspects of semiconductor manufacturing and development. Prior to moving to Qualcomm, Bill was Director of Outsource Engineering and Product and Test Engineering at IBM Microelectronics Division with broad responsibility for managing multiple new products and technologies at the IBM 300mm Fabricator as well at IBM’s partner fabricators. In this role Bill and his teams would perform characterization and yield analysis of Digital CMOS Products as well as product test and diagnostics to drive in fab improvements to reduce defects and reduce device variation to maximize performance. In addition Bill has experience with process integration, in line defect inspection and detection, failure analysis, Fab Operations and efficiency, and equipment engineering. Bill is also an author of multiple published articles and professional society presentations, patent holder, and former technical general chair of the ASMC conference and former chairman of the Industrial Advisory Board for the Center for Microcontamination Control at U of A, RPI, and Northeastern University.