Strategic Materials Conference - SMC 2015 Agenda

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Tuesday, September 20

7:30am-8:30am 

 

 

Continental Breakfast / Registration

     
8:30am-8:35amDenny McGuirk-SMC 2015  

Welcome Remarks

Denny McGuirk (Biography)
President and Chief Executive Officer
SEMI

     
8:35am-8:40am         Mark Thirsk  Opening Remarks

Mark Thirsk (Biography)
Managing Partner
Linx Consulting

Co-Chair, SMC 2016 Committee
     
8:40am-9:20am

 

 

Keynote 1:

Dr. John Hu
Director of Advanced Technology
Nvidia Corporation

     
9:20am-9:50amIngrid (Ying) Shi  

Keynote 2: 

Ingrid Y. Shi
Secretary-General, China

The Integrated Circuit Materials Industry Technology Innovative Alliance

     
     
9:50am-10:20am   Networking Break Sponsor:  KMG Chemicals
     
     
SESSION 1:  ECONOMIC / MARKET TRENDS
Session abstract - Market forces that drive demand for semiconductor process materials not only involves the influence / demand from chip fabricators, but also involves end use applications, largely influenced by consumer demand, locally and globally.  The first day of the Strategic Materials Conference will feature, the Economic and Market Trends Session.  Here, the semiconductor business environment will be presented from various vantage points - from the materials perspective through chip fabricator, to the global economic view point.  Information on materials and business trends for a broad range of semiconductor device technologies, and the driving forces behind these trends, will be presented in the form of four key presentations.  Market experts will present their findings on market trends in materials and semi equipment growth, semiconductor production demand, and end user applications.   In addition, a “views from wall street perspective” and global economic influences on the semi market will be presented, connecting the semiconductor market to Wall Street, and to the world.
  
     
     
10:20am-10:50am   Duncan Meldrum, Hilltop Economics, LLC
     
10:50am-11:20am   

E. Jan Vardaman, President, TechSearch International, Inc.

     
11:20am-12:20pm   

“Views from Wall Street”

Bank of America, Evercore, Needham & Company

Moderater:  Wenge Yang, Vice President of Marketing, Entegris

     
     
     
12:20pm-1:30pm   Lunch
    

 

     
     
SESSION 2:  FUTURE of MOORE's LAW and ENCOUNTERS OF A 3D KIND 

Last year marked the 50th anniversary of Moore’s Law, the engine that has powered the Semiconductor Industry for the past five decades.  Along the way there have been naysayers proclaiming that this pace of two dimensional (2D) CMOS scaling could not be maintained and that Moore’s Law would soon crack.  Recently there have been noticeable and well publicized cracks in many areas of the factory from Lithography to Interconnect.  This session addresses traditional 2D scaling challenges faced by industry in sub-10nm technology through the filter of materials related opportunities and solutions.

One alternative that has surfaced, in part due to the cracks present in 2D CMOS scaling, is the idea of true monolithic three-dimensional scaling.  This new 3D focus holds true to the original tenets of Moore’s Law, but literally turns it on its side.  Yes, the transistor count metric will continue, and it must, but there are many more facets.  Density will not be defined by planar density, but by its cubic density.  In this global skyscraper like race to the z-dimension the 2D scaling rules can be relaxed a bit, but new challenges arise in the vertical.  OEM’s, Material Suppliers, and Chip Manufacturers are encountering specific demands of this new paradigm.  This session will look to those companies for insights on the Material based issues.

     
1:30pm-1:35pm   

Kevin Peterson - Session Moderator
Director Sales & Marketing
JX Nippon Mining & Metals, USA

      
     
2:05pm-2:35pm   

Adrien LaVoie
Director, Engineering, Dielectric ALD / Deposition Products Group
Lam Research Corporation  

     
2:35pm-3:05pm   Pratik Joshi, Ph.D.
Staff Engineer, Materials Technology
Samsung Austin Semiconductor
     
3:05pm-3:30pm   

Networking Break - Sponsor: 

     
3:30pm-4:00pm   

TBD

     
4:00pm-4:30pm   

Phillippe Rodriguez
Process Engineer, R&D Materials
CEA-LETI

       
4:30pm-5:00pm   

Yang Du, Ph.D.
Senior Director, Technology, ASIC
Qualcomm Research

 

5:00pm-7:00pm   Reception- Sponsor:   JX Nippon Mining and Metals
     
Wednesday, September 21   
     
SESSION 3:  DISRUPTIVE TRENDS AND OPPORTUNITIES FOR NEW MATERIALS: Sponsor:  Linde Group

Demand for traditional electronics markets such as PC's and smartphones has been slowing in recent years. However, there are many emerging and potentially disruptive trends that will drive demand for new materials.

Autonomous vehicles, virtual reality and the proliferation of IoT will drive demand and innovation in areas such as flexible, hybrid and printed electronics, novel memory devices such as 3D Xpoint, thin film batteries and advanced logic architecture.

This session will focus on some of these emerging trends and the challenges manufacturers and suppliers will confront as these technologies are brought into high volume manufacturing. 

     
7:30am-8:30am   Continental Breakfast
     
     
8:30am-8:35am  

Welcome/Introduction

Bob Cates (Biography) - Session Moderator
Director, Business Strategy and Planning
Cabot Microelectronics

Co-Chair, SMC 2016 Committee

     
     
8:35am-9:05amAnton DeVilliers

 

 

Keynote 2

Dr. Anton DeVilliers
Sr. Technologist Lithography
Tokyo Electron America

     
9:05am-9:35am   

Scott Sills, Ph.D. 
Senior Member Technical Staff
Micron Technology, Inc.

 

     
9:35am-10:05am   

James R. Buntaine, Ph.D.
Country Lead, Advanced Technologies
EMD Performance Materials Corp.

 

     
10:05am-10:35am   

Tony Flaim, Ph.D.
Chief Technical Officer
Brewer Science

     
     
10:35am-11:00am   Networking Break - Sponsor:  EMD Performance Materials Corporation
     
     
 

SESSION 4:  ADVANCED PACKAGING:

Market size estimates for the value of the module market by ASE are of the order of $60 billion for 2015, with CAGR of better than 10% through 2018.  Packaged modules are close to the size of the chips being packaged (chipscale packages), and include hybrid systems that include ICs and passives.  Advanced packaging technologies can be seen as enabling the Internet of Things, and extending the scaling of advanced devices.  As packaged modules are developed for various applications manufacturers strive to meet the Performance, Power, and Cost (PPC) requirements set by the system designer, and package types must meet the needs for different system types such as mobile or computing, and each competitor in the market attempts to develop proprietary packaging technologies and designs that steal a march over others a dizzying list of package types being introduced to the market.


For much of the last decade of 3-D packaging TSV technology has been the center of an approach to develop very high density hybrid or stacked device packages.   It is now clear that the TSV package is not a panacea, and a multitude of proprietary technologies and package designs are appearing to meet advanced packaging requirements. This session will review some of the materials aspects key to advanced packaging.

 
 
 
     
     
11:00am-11:05am

 

 

 

Aldo Orsi - Session Moderator
Global Key Account Manager
EMD Performance Materials Corp.

     
     
     
11:05am-11:35pm 

 

 

Ivor Barber 
Senior Director Package Technology Development
Xilinx, inc.​

 

     
11:35am-12:05pm 

 

 

Dongkai Shangguan, Ph.D.
Vice President of Advanced Technology Marketing and Chief Marketing Officer
STATS ChipPAC

 

 

 

 

 

12:05pm-12:35pm 

 

 

Rozalia Beica
Global Director, New Business Development, Dow Electronic Materials
The Dow Chemical Company

     
12:35pm-1:40pm   Lunch   Sponsored by: 
     
SESSION 5:  CONTAMINATION AND METROLOGY CHALLENGES:  

Driven by the increasing technology challenges, materials and equipment innovation and thus escalating cost the process complexity increases in the industry's continuous pursuit of Moore's Law.  Defect reduction and yield enhancement have become critical differentiators in determining the economics of a successful node shrink. Devices have become increasingly sensitive to the various sources of contaminants during the wafer fabrication process, which makes contamination detection, identification and control a focal point in fab operations and global supply chain strategy. Recent developments have shown much tighter control specifications in terms of particles, metals, other inorganic and organic contaminants. This has prompted next generation of equipment, materials, and fab design concepts that are designed to specifically address contamination control issues at advanced technology nodes.

The session will present a comprehensive picture of how the industry value chain participants (IDM, Equipment, chemicals) need collaboration and preparing to address contamination control and metrology challenges for sub 20nm era. You'll hear perspectives from:

1. IDM / foundry about the current contamination control challenges and requirements to achieve a successful sub 20nm node ramp.

2. Equipment producer discussing new developments in process tools and metrology/defect inspection tools to detect contaminants and minimize them during the wafer fabrication process.

3. Materials and sub-component makers regarding a new push to eliminate various types of contaminants in the materials manufacturing, shipment, and dispensing process before they reach the wafer.

   
1:40pm-1:45pm 

Ravi Kanjolia, Ph.D. - Session Moderator
Chief Technical Officer
EMD Performance Materials Corp. - Deposition Materials

   
1:45pm-2:15pm Archita Sengupta, Ph.D. 
Technologist, TSO/MCSC Program Manager
Intel Corporation
     
2:15pm-2:45pm 

Kartik Venkataraman
Sr. Product Marketing Manager
KLA-Tencor

   
2:45pm-3:15pm 

James O’Neil, Ph.D.
Chief Technical Officer
Entegris

   
3:15pm-3:40pm Networking Break- Sponsor: JSR Micro
   
   
SESSION 6:  A VIEW FROM THE FABS - EXECUTIVE PANEL DISCUSSION

The panel discussion “Strategic Materials Challenges from the Perspective of the Fabs" will close the conference.  The discussion will focus on the current and emerging material challenges.   Participants on the panel will be asked to present a ten minute commentary on the issues related to materials these companies are facing in meeting their customer’s expectations as well as how these expectations are evolving in the environment of slow growth, cost sensitivity & consolidation.   Topics that are encouraged for discussion include new material needs, supply chain challenges, and how to build collaborative relationships that result in a win-win for both the device manufacturer and the supplier community.  Following the presentations will be a moderated Q&A session with the audience to further explore these topics as well as issues that may subsequently rise during the open dialogue.

   
   
   
3:40pm-3:45pm Kurt Carlsen- SMC 2015

Kurt Carlsen - Session Moderator
Director, Strategic Sourcing
Air Liquide Electronics

SMC 2016 Committee

  
 
   
3:45pm-4:00pm 

Tim Hendry
Vice President and Director of Fab Materials Operations
Intel Corporation

   
4:00pm-4:15pm  
   
4:15pm-4:25pm 

 

   
   
   
4:25pm-4:55pm 

EXECUTIVE PANEL DISCUSSION

 

   
   
4:55-5:00pm  Maria Peterson-SMC 2015

Closing Remarks

Maria Peterson, PhD
Corporate Venturing & Innovation
JSR Micro, Inc. 

Chair, SEMI CGMG Committee

 

   

Agenda as of May 19, 2016. Subject to change.

 

Go back to http://www.semi.org/smc