Tuesday, September 20
Registration & Continental Breakfast -- Sponsor: Materion
Denny McGuirk (Biography)
Mark Thirsk (Biography)
Co-Chair, SMC 2016 Committee
From Materials To Artificial Intelligence—
Wilmer R. Bottoms, Ph.D. (Biography)
|9:45–10:15||Networking Break Sponsor: KMG Chemicals|
|Session 1: ECONOMIC / MARKET TRENDS|
|Market forces that drive demand for semiconductor process materials not only involves the influence / demand from chip fabricators, but also involves end use applications, largely influenced by consumer demand, locally and globally. The first day of the Strategic Materials Conference will feature, the Economic and Market Trends Session. Here, the semiconductor business environment will be presented from various vantage points - from the materials perspective through chip fabricator, to the global economic view point. Information on materials and business trends for a broad range of semiconductor device technologies, and the driving forces behind these trends, will be presented in the form of four key presentations. Market experts will present their findings on market trends in materials and semi equipment growth, semiconductor production demand, and end user applications. In addition, a “views from wall street perspective” and global economic influences on the semi market will be presented, connecting the semiconductor market to Wall Street, and to the world.|
|10:15-10:20||Session Moderater: |
Vice President, Marketing
Economic Uncertainty, the Global Economy and Semiconductors
Duncan Meldrum (Biography)
The Impact of Disruptive Technology on the Materials Market
E. Jan Vardaman (Biography)
“Views from Wall Street” Materials Innovation to Drive Growth in a Maturing Industry
Y. Edwin Mok (Biography)
Street View on the Sector
Krish Sankar (Biography)
|Perspectives on an Unprecedented Semiconductor M&A Environment
Tom Stokes (Biography)
|Session 2: FUTURE of MOORE's LAW and ENCOUNTERS OF A 3D KIND|
Last year marked the 50th anniversary of Moore’s Law, the engine that has powered the Semiconductor Industry for the past five decades. Along the way there have been naysayers proclaiming that this pace of two dimensional (2D) CMOS scaling could not be maintained and that Moore’s Law would soon crack. Recently there have been noticeable and well publicized cracks in many areas of the factory from Lithography to Interconnect. This session addresses traditional 2D scaling challenges faced by industry in sub-10nm technology through the filter of materials related opportunities and solutions.
One alternative that has surfaced, in part due to the cracks present in 2D CMOS scaling, is the idea of true monolithic three-dimensional scaling. This new 3D focus holds true to the original tenets of Moore’s Law, but literally turns it on its side. Yes, the transistor count metric will continue, and it must, but there are many more facets. Density will not be defined by planar density, but by its cubic density. In this global skyscraper like race to the z-dimension the 2D scaling rules can be relaxed a bit, but new challenges arise in the vertical. OEM’s, Material Suppliers, and Chip Manufacturers are encountering specific demands of this new paradigm. This session will look to those companies for insights on the Material based issues.
Addictive Nature of Moore's Law to Materials Innovation
Srinivasa Banna, Ph.D. (Biography)
Atomic Layer Processing via ALD/ALE for Semiconductor Fabrication
Adrien LaVoie (Biography)
What Do You Mean When You Say Moore's Law?
Benjamin G. Eynon (Biography)
Networking Break - Sponsor: SACHEM
Scaling Challenges for Technology and Design Architectures for Advanced MOL BEOL Technology Nodes
Larry Clevenger, Ph.D. (Biography)
Materials Challenges for 3D Sequential Integration
Philippe Rodriguez (Biography)
VLSI Design in the 3rd Dimension
Yang Du, Ph.D. (Biography)
|5:00–7:00||SMC 2016 Reception -- Sponsor: JX Nippon Mining and Metals|
Wednesday, September 21
Session 3: DISRUPTIVE TRENDS AND OPPORTUNITIES FOR NEW MATERIALS
Sponsor: Linde Electronics
Demand for traditional electronics markets such as PC's and smartphones has been slowing in recent years. However, there are many emerging and potentially disruptive trends that will drive demand for new materials.
Autonomous vehicles, virtual reality and the proliferation of IoT will drive demand and innovation in areas such as flexible, hybrid and printed electronics, novel memory devices such as 3D Xpoint, thin film batteries and advanced logic architecture.
This session will focus on some of these emerging trends and the challenges manufacturers and suppliers will confront as these technologies are brought into high volume manufacturing.
Sponsor: Air Liquide Electronics
Welcome and Introduction
A Critical Look at Material Challenges Emerging as a Result of Patterning becoming Integrated and Self- aligned
Anton DeVilliers, Ph.D. (Biography)
Vanishing Space and Shifting Tectonics for Integrated Circuits
Scott Sills, Ph.D. (Biography)
Hybrid Electronics: Enabling New Applications with Novel Materials
James R. Buntaine, Ph.D. (Biography)
“Welcome to the Fourth Floor” Transfer Bonding as a New Fabrication Processe
Tony D. Flaim, Ph.D. (Biography)
|10:35–11:00||Networking Break -|
Sponsor: EMD Performance Materials
Session 4: ADVANCED PACKAGING:
Market size estimates for the value of the module market by ASE are of the order of $60 billion for 2015, with a CAGR greater than 10% through 2018. Packaged modules are close to the size of the chips being packaged (chipscale packages), and include hybrid systems that include ICs and passives. Advanced packaging technologies can be seen as enabling the Internet of Things, and extending the scaling of advanced devices. As packaged modules are developed for various applications manufacturers strive to meet the Performance, Power, and Cost (PPC) requirements set by the system designer, and package types must meet the needs for different system types such as mobile or computing, and each competitor in the market attempts to develop proprietary packaging technologies and designs that steal a march over others, resulting in a dizzying list of package types being introduced to the market.
Strategies for Heterogeneous Integration
Ivor Barber (Biography)
Process & Materials Challenges for Advanced Packaging
The Role of Advanced Materials and System Integration in an Application Driven Industry
Rozalia Beica (Biography)
|Session 5: CONTAMINATION AND METROLOGY CHALLENGES: Sponsor:Teflon Fluoroplastics
Driven by the increasing technology challenges, materials and equipment innovation and thus escalating cost the process complexity increases in the industry's continuous pursuit of Moore's Law. Defect reduction and yield enhancement have become critical differentiators in determining the economics of a successful node shrink. Devices have become increasingly sensitive to the various sources of contaminants during the wafer fabrication process, which makes contamination detection, identification and control a focal point in fab operations and global supply chain strategy. Recent developments have shown much tighter control specifications in terms of particles, metals, other inorganic and organic contaminants. This has prompted next generation of equipment, materials, and fab design concepts that are designed to specifically address contamination control issues at advanced technology nodes.
The session will present a comprehensive picture of how the industry value chain participants (IDM, Equipment, chemicals) need collaboration and preparing to address contamination control and metrology challenges for sub 20nm era. You'll hear perspectives from:
1. IDM / foundry about the current contamination control challenges and requirements to achieve a successful sub 20nm node ramp.
2. Equipment producer discussing new developments in process tools and metrology/defect inspection tools to detect contaminants and minimize them during the wafer fabrication process.
3. Materials and sub-component makers regarding a new push to eliminate various types of contaminants in the materials manufacturing, shipment, and dispensing process before they reach the wafer.
The Future of Contamination Control & Next Generation Supply Chain for Beyond 14nm Node Semiconductor Processes
Archita Sengupta, Ph.D. (Biography)
Optical Films Metrology Solutions for 10nm CMOS Process Challenges
Kartik Venkataraman (Biography)
Putting the Pieces Together: Advanced Materials Solutions for 10nm & Beyond
James O’Neill, Ph.D. (Biography)
|3:15–3:40||Networking Break- Sponsor: JSR Micro|
|SESSION 6: A VIEW FROM THE FABS - PANEL DISCUSSION
The panel discussion “Strategic Materials Challenges from the Perspective of the Fabs" will close the conference. The discussion will focus on the current and emerging material challenges. Participants on the panel will be asked to present a ten minute commentary on the issues related to materials these companies are facing in meeting their customer’s expectations as well as how these expectations are evolving in the environment of slow growth, cost sensitivity & consolidation. Topics that are encouraged for discussion include new material needs, supply chain challenges, and how to build collaborative relationships that result in a win-win for both the device manufacturer and the supplier community. Following the presentations will be a moderated Q&A session with the audience to further explore these topics as well as issues that may subsequently rise during the open dialogue.
Michael Matragrano, Ph.D. (Biography)
|4:00–4:10||Benjamin G. Eynon (Biography)|
Sr. Director, Engineering Development
Larry Clevenger, Ph.D. (Biography)
PANEL DISCUSSION: View from the Fabs
Agenda as of September 18, 2016. Subject to change.
Go back to http://www.semi.org/smc