SEMI Members Only: Malaysia Forum 2013


This event was held on November 20, 2013 at the Eastin Hotel in Penang, Malaysia

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Presentations available for download for SEMI Members. SEMI Membership is required to access these SEMI Member Only documents. If your company is a SEMI member, but you do not have a profile create one now. Be sure to use your company e-mail when you create or update your profile. SEMI recognizes your membership status using your company email address.

Guaranteed Growth for Smart Devices
Ms. Selinna CHIN, Managing Director (Consumer Choices), GfK
SEMI Market Update & Outlook: Equipment and Materials
Ms. Bettina WEISS, Vice President, SEMI Global Business Development
Semiconductor Industry: Finance, Secondary Equipment, Mergers & Acquisitions... and Profitability!
Mr. Melvin LOW, CEO, Equvo Pte Ltd
Transforming Wire Bond Eco System
Mr. M. Sivakumar, Technical Marketing Manager, ASM Technology
 Challenges & Solution for Fine Pitch Cu Pillar Filp Chip Bonding Process
Mr Nelson FAN Chun Ho, Business Development Manager, ASM Technology
  What will drive the ATE Market beyond 2013?
Mr. Michael FRAZIER, Market Development, LTX-Credence Corporation
Challenges Faced in Testing Wideband Power Amplifier Devices (LTE Advanced and 802.11ac)
Mr. Lenny LEON, SR RF Marketing Technologist, LTX-Credence Corporation
 Flip Chip Technology for 2.5D and 3D Packaging
Dr. LEE Teck Kheng , Director (Technology), Institute of Technical Education (ITE) College Central

Pushing the Wire Bonding Boundary
Mr. Nelson WONG, Vice President (Wire Bond Solutions Business Unit), Kulicke & Soffa Pte Ltd


"From CU Wire Bonding to Thermo-Compression Bonding for Advanced Packaging"
Mr. Patrick DESJARDINS, Director (Product Marketing), Kulicke & Soffa Pte Ltd

Solutions for HVM Advanced Copper Wire Bonding Challenges and Silver Alloy Bonding - A Capillary Perspective
Mr. Jason TAN, Product Manager, Small Precision Tools/SPT Asia Pte Ltd

Developments in One Step Chip Attach (OSCA) for Thermo-compression Bonded Advanced Packaging
Dr. Christopher BREACH, Head (Technology R&D), Kester Components Pte Ltd

The Critical Role Of OSAT In Ever Changing Semiconductor Industry
Mr Moses CHEE, Director, Technical & Business Development, ASE Electronics (M) Sdn Bhd

Enabling System-Level Test on ATE: Vision, Challenges, and Where We Are Today
Dr. Clemens LEICHTLE, Director (V93000 SOC Center of Expertise), Advantest Europe GmbH

2.5/3D Wafer Test Trend and Solution
Mr. Ben ELDRIDGE, CTO,  Form Factor
Introduction to Fluxless High Volume Manufacture for Advanced 2.5/3DiC Packaging
Dr. Jian ZHANG, President, SEMIgear, Inc.
Advanced Package Challenges to Wafer Test
Mr. Fred SATO, Senior Manager (ATS Marketing Dept. ATSBU), Tokyo Electron Limited