The 450mm Wafer Size Transition - | |
This event was held on: 7 Feb 2014 | |
Presentations available for download for SEMI Members. SEMI Membership is required to access these SEMI Member Only documents. If your company is a SEMI member, but you do not have a profile create one now. Be sure to use your company e-mail when you create or update your profile. SEMI recognizes your membership status using your company email address. Proposed and supported by BRIDGE450 partners Almost a billion Euros of investment in Europe combined with the G450C initiative based in Albany New York is making the 450mm wafer size transition a reality. It is forecast that by around 2026 usage of this wafer size will equal that of 300mm. This transition will inevitably lead to many opportunities for the European Semiconductor E&M community, both in the building of new 450mm fabs and also in improvements to existing 300mm fabs derived from the same new technologies and techniques. | |
PROGRAM | |
| Welcome Yann Guillou, Business Development Manager, SEMI Europe Grenoble Office Veroni Ballet, Project Coordinator, imec | |
 Introducing the Bridge450 InitiativeMike Bryant, CTO Future Horizons | |
| 450mm Collaborations – A Viewpoint From an SME Alain Jarre, CEO Recif Technologies | |
| Networking Lunch | |
| IMEC 450mm Pilot Line and Related Technologies Hans Lebon, sVP Fab and Process Step Development imec | |
| Update of the SMART2010/062 Report on 450mm Manufacturing Malcom Penn, CEO Future Horizons | |
| EEMI450 Update and Wrap-up Bas van Nooten, Consultant and Spokeman EEMI450 Semi Consulting | |
| Coffee and Networking Speakers and Bridge450 partners will be available for discussions | |
| End | |
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Bridge450 is a work program defined under the Objective FP7-ICT-2013-11 “An action to develop a European strategy which addresses the challenges in manufacturing for 450 mm in dialogue with G450C and with the US, Korea and Taiwan.” | |
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