Make a Date with the Future
By Kai Fai Ng, president, SEMI Southeast Asia
“Make a Date with the Future” — That tagline caught my attention today as we began rolling out the SEMICON Singapore 2014 press information to various media outlets. This statement captures the imagination and vision of how we might see our industry as it transforms the landscape of the IoT. Enabling mobility to such applications is an escalating trend that today’s most advanced electronic device makers are tackling head on. In line with the theme of this year’s SEMICON Singapore, I am delighted to present to you, a glimpse, perhaps, of such a future at the SMART Living SMART Future pavilion at the show!
While the industry gears up to make this technology advancement a reality, many challenges remain that need attention. For example, the packaging and test operations front is currently facing major inflection points. In packaging, IDMs, foundries, and OSATs have not agreed upon an industry-wide path toward 2.5D/3D stacked ICs, delaying high-volume adoption. Consequently, Gartner currently forecasts that TSV devices will account for less five percent of the units in the total wafer-level packaging market by 2017.
Recognising this, the SEMICON show this year will be hosting a WLP and 2.5D/3D IC Standards Forum led by Jan Vardaman, Francoise Von Trapp, Dr. Tim Lenihan, the SEMI Standards committee and a panel consisting of Southeast Asia’s leading design house, IDMs, foundries and OSATs to discuss and share significant standards efforts underway to address many of the challenges in 2.5/3D IC that are necessary to accelerate stacked IC adoption. I welcome you to join in and share your views and expertise in this open forum discussion.
I would like to take a moment to thank the astute companies who are sponsors for this year’s SEMICON show. Thank you to Kulicke & Soffa, KLA-Tencor, ASM, Dainippon, ASE Group, GLOBALFOUNDRIES, Advantest, Entegris, EVG, Semitronix, and Applied Materials.
See you at SEMICON Singapore 2014, Marina Bay Sands, 23rd to 25th April. Be There!
April 2, 2014