SEMI China Show: Addressing the Major Developments in China's Semiconductor Industry
By Gang Yao, SEMI China
The SEMICON China 2014 show, co-located with FPD China and SOLARCON China, covered 61,700 square meters of exhibition space and attracted 941 exhibitors (from 30 countries and regions), 2,588 booths and more than 100 government delegates. High-quality products at the exhibition and the conference topics attracted over 43,000 attendees. With dozens of co-located events as well, this event in China has become the world's largest semiconductor industry event, and SEMI has become an integral organization to promote the development of China's semiconductor industry.
The exhibition close to market demand and innovative development
A growing number of smart products were introduced in the Smart Life Pavilion, and the Pavilion demonstrated the interoperability between smart homes will form a foundation for the “Smart City” eventually. For SEMICON China 2014, a new area of the Smart Life Pavilion opened in N5 Hall, Shanghai New International Expo Center, intensively showcasing smart transport, smart house and the latest application technology of the Internet of Things -- enabling attendees to experience the innovation of smart-life, the combination of the Internet of Things and the semiconductor technology.
The LED Manufacturing Pavilion is the only LED manufacturing theme exhibition in China and the biggest industry event covering the full LED manufacturing supply chain in the world. The scale of the LED Manufacturing Pavilion was expanded to include the entire LED manufacturing chain, gathering worldwide LED manufacturing, equipment and materials, and all the latest technology in one place. The Touch Screen Pavilion covered the whole industry chain including touch screen manufacturing, advanced equipment, materials, design and applications. It is the only tradeshow for touch and display.
Tech Forums help to explore the industrial development
To guarantee the healthy and sustainable development of the semiconductor industry, it is important to optimize the quality and direction of industrial development with policies. In the Grand Opening Ceremony, Tetsuro Higashi, the chairman of TEL, indicated that China and Japan need to continue the development of core technologies, and strengthen strategic cooperation for industry consolidation.
Tzu-Yin Chiu, the CEO of SMIC, said that SMIC had advanced the process node to 28nm in the fourth quarter of 2013, and soon will develop into the 20/14nm technology node.
The Tech Investment Forum-China 2014 aimed to establish a platform between investment and various fields of the pan-semiconductor industry. World-renowned company leaders, financial experts and investors gathered to discuss on technology innovation trends and investment opportunities in emerging high-tech industry. Shaojun Wei, chairman of the China Semiconductor Industry Association IC Design Branch, said that the government should make appropriate allocation of resources.
In CSTIC 2014, one of the largest and the most comprehensive annual semiconductor technology conferences in China, Dr. Xuwu Li, EVP of SMIC, stated in his speech “The Opportunities and Challenges in China Technology Research and Development Market,” that “There are huge opportunities in the China semiconductor industry’s innovative market, especially in mobile devices and smart phone market. SMIC is constantly developing more advanced technology to meet the needs of the Chinese market, while China needs to make full use of development resources in the combination and build a pan-semiconductor industry ecosystem.”
In the Advanced Packaging Technology Forum, Dr. Ed Chang, business development director of TSMC, presented on "IC and Package Evolution." He said that mobile and high-performance products will continue to drive demand for advanced back-end manufacturing. Gregory Smith, general manager, Computing & Communications Business Unit at Teradyne, predicted that the growth rate of smart phones would be slowing down after 2016, a variety of connectivity products would drive the growth of the semiconductor industry, and 3D-IC technology would be required for small connected devices, especially wearable devices to obtain real success.
In the China Equipment Market Forum, Tianyuchun Ye from the Institute of Microelectronics at the Chinese Academy of Sciences, said that the supply of the domestic equipment is less than the demand, the international and the local industries should strengthen the cooperation to cope with Chinese demand for the advanced semiconductor manufacturing process. Roger Chang, president of Applied Materials China, hopes to cooperate with China’s IC industry to enhance the technical capacity and size of the global supply chain in China.
In the IC Applications from Design to Manufacturing Forum, Shaojun Wei said that 3D packaging technology has brought new opportunities to the industry, and it expected that there would be closer cooperation in IC packaging, design and manufacturing. Michael Horne, the Asia-pacific Region sales vice manager of ARM, indicated that rapid formation of the wearable technology market had brought great potential, and that there would be a shipment of 485 million wearable devices in 2018. Timothy Lau, director of Joint Product Line of Broadcom, predicted that all vehicles would be networked by 2025, and 75 percent of cars could achieve autonomous driving in 2035. Eric Zhu, manufacturing director of Spreadtrum, thought that customization and differentiation would be important factors to win the market and close cooperation could enhance the local industry chain’s overall competitiveness.
In the More-than-Moore Technology Forum, Leopold Beer, regional president of Asia Pacific at Bosch, stated that MEMS sensor technology only focused on the technical before, but now it concerns much more than the technical combination. The "smart home" program can be realized simply by using a cell phone to control all the devices in your home, and many of these products are expected to be introduced to the market this year or next year. And Qixing Liu of ASMC pointed out, “Currently more than half of the silicon technology used is More than Moore technology, and the pressure sensor will be more than 8 percent annual growth rate, but the low cost, small size is a challenge.”
SEMI is intricately involved in the process of the sustained and rapid development of China's semiconductor industry. Many opportunities are available. For more information, visit www.semichina.org or www.semi.org.
April 2, 2014