Webinar: Semiconductor Market Overview and Packaging Material Trends

Webinar: Semiconductor Market Overview and Packaging Material Trends

Date: February 27, 2014
Time: 10:00 am Pacific Time
Cost: $100.00/webinar and FREE to SEMI members

Join us for this informative webinar presented by SEMI and TechSearch International. This industry research webinar will focus on a semiconductor market overview for 2014 and trends in semiconductor packaging materials.

The webinar will cover:

• What is the outlook for the global economy in 2014?
• Will there be single- or double-digit revenue growth?
• What are the industry growth engines?

Presenters:

		Semiconductor Market Overview for 2014 Dr. Dan Tracy, Sr. Director, Industry Research & Statistics, SEMI This presentation will highlight the industry outlook for 2014, including forecasts for the equipment and materials markets. The most current data and trends based on 2013 figures will be presented.
		Packaging Materials Trends — Mobility is the Key Market Driver Jan Vardaman, President, TechSearch International Portable consumer devices are the top growth drivers of electronics, and consumers want smaller and thinner products with increased functionality. These demands are driving growth of thin package solutions and require new materials to address issues related to package performance, reliability, and thermal management. Issues, trends, and opportunities in the packaging materials segment of the industry will be discussed.

Speaker Bios

Dr. Dan Tracy, Sr. Director, Industry Research & Statistics, SEMI

Dan P. Tracy is responsible for developing and executing the global strategy for SEMI industry research and statistics products and services. Current market statistics products include monthly and quarterly data programs covering semiconductor capital equipment, materials and components, with in-depth annual reports on a variety of topics such as packaging materials and trends in the China market. Tracy is responsible for preparing market reports and presenting on trends impacting the electronic materials and equipment markets globally. In addition, Tracy is responsible for managing market statistics partnerships globally.

Jan Vardaman, President, TechSearch International

E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided analysis on technology and market trends in semiconductor packaging since 1987.  She is co-author of How to Make IC Packages (published in Japanese by Nikkan Kogyo Shinbunsha), a columnist with Printed Circuit Design & FAB/Circuits Assembly Magazine, and the author of numerous publications on 3D packaging.  She is a member of IEEE CPMT, IMAPS, MEPTEC, SMTA, and SEMI.