ASMC 2014 - Agenda
Conference Agenda and Highlights
Directed Self Assembly (DSA)
Session 1: Yield Enhancement
Chairs: Larry Pulvirent, GLOBALFOUNDRIES; Raymond van Roijen, IBM
Characterization techniques for driving yield are critical for successful semiconductor manufacturing. This session covers analysis of volume diagnostic data, an alternative array design to SRAM as a yield learning vehicle and a case study on eliminating a contact shorting mechanism.
Session 2 - Advanced Metrology I
Chairs: Sathish Veeraraghavan, KLA-Tencor; Alok Vaid, GLOBALFOUNDRIES
Novel processes and complex materials are putting significant pressure on measurement tool-sets. Advanced metrology session that discusses novel applications and use-cases of metrology techniques including ellipsometry, X-Ray, MBIR, to characterize various advanced processes.
Session 3 – 3D/TSV
Chairs: Sagar Kekare, KLA-Tencor; James Lu, RPI; Thuy Tran-Quinn, IBM
This session will cover key innovation in the field of 3D/Through-silicon via technology (TSV) including TSV processing, wafer thinning, and metrology.
Session 4A – Advanced Process Control (APC)
Chairs: Agnes Roussy, EMSE; Philippe Campion, STMicroelectronics
Innovations for advanced process control, including prediction of deposition rates,predictive maintenance and virtual metrology.
Session 4B – Factory Optimization
Chairs: Dave Gross, GLOBALFOUNDRIES; Thomas Beeg, GLOBALFOUNDRIES
Semiconductor equipment and manufacturing is increasingly complex and driven by strict economic constraints, making it essential for IC makers to maximize fab productivity and efficiency. This session discusses new strategies and solutions to optimize fab layout, production logistics, and equipment maintenance.
Session 5 - Interactive Poster Session
Chairs: Alan Brightman, Edwards Vacuum; Thanas Budri, Texas Instruments; Russell Dover, Lam Research; Eric Eisenbraun, CNSE; Larry Hennessy, CHM2 Hill; Dick James, Chipworks; Jason J. Mazzotti, IBM; Kazunori Nemoto, Hitachi High Tech; Jan Rothe, GLOBALFOUNDRIES; Patrick Varekamp, IBM; Naomi Yoshida, Applied Materials
This session presents enabling technologies, process improvements, and novel approaches to semiconductor manufacturing.
Session 6 - Advanced Metrology II
Chairs: Alok Vaid, GLOBALFOUNDRIES; Amiad Conley, Applied Materials
Novel processes and complex materials are putting significant pressure on measurement tool-sets. The advanced metrology session that covers novel applications and implementation of metrology techniques including CD-SEM, Kelvin Probe, CV probe to characterize various advanced processes.
Session 7 – Defect Inspection I
Chairs: Jeanne Bickford, IBM; Jeff Barnum, KLA-Tencor
Defect inspection is integral to the development and manufacture of semiconductor devices. This session will feature papers describing various optical techniques to detect defects in advanced designs and materials, including 2x nm CMOS, 3D NAND, and III-V epitaxial layer growth.
Session 8 – Equipment Reliability and Productivity Enhancement
Chairs: Stefan Radloff, Intel Corporation; Gary Green, Alphray; Adrienne Pierce, Edwards Vacuum
The challenges of current and future semiconductor process technologies require a higher level of equipment reliability, quality, repeatability and productivity. Optimizing equipment performance will help improve fab metrics, minimize wafer costs and maximize competitiveness. Papers in this session will review ideas and successes which helped optimize equipment utilization and tool performance.
Session 9 - Contamination Free Manufacturing (CFM)
Chairs: Chris Long, IBM; Matt Wagner, Pall Microelectronics
Contamination Free Manufacturing: Control of the local wafer environment is vital to achieving critical rapid yield ramps. This session will feature papers focused on next generation carriers, wafer edge defectivity mitigation, and environment control.
Session 10 – Data and Yield Management
Chairs: Franz Heider, Infineon; Dieter Rathei, D R Yield
Semiconductor engineers are continuously striving to improve data capture and analysis techniques to speed up yield ramps and extract the last possible yield in the fab. In this session, we explore hard and soft SRAM bit fail analyses for faster ramp, yield optimization using scribe referencing and advanced data mining techniques for consumables.
Session 11 - Discrete Power Devices/Emerging Technologies
Chairs: George Kong, Peregrine Semiconductor; Rob Pearson, Rochester Institute of Technology
Emerging Technologies must address trades offs and challenges to solve problems such as power density, communication and integration. This session presents improvements and potentially disruptive technologies in power device parametrics, photonic integration with CMOS, discrete semiconductor and novel material characterization which address these challenges.
Session 12 - Advanced Patterning/DFM
Chairs: Jacek Tyminski, Nikon Research; Anton deVilliers, Tokyo Electron
Advanced patterning and design for manufacturing (DFM) are key elements of leading edge semiconductor fabrication. This session covers innovations in improving double patterning, in DSA metrology, and in a DFM methodology exploring how local proximity can affect device performance.
Session 13 – Advanced Equipment and Materials I
Chairs: Russell Dover, Lam Research; Brett Williams, ON Semiconductor
Advanced memory, analog and logic manufacturers face daunting challenges as the next generation device nodes come on line. These challenges are being met by the development and applications of innovations in equipment, materials, and processes. This session will focus on and will highlight some of the latest innovations that are being implemented in leading edge high volume manufacturing.
Session 14 – Defect Inspection II
Chairs: Jennifer Braggin, Entegris; Anand Subramani, KLA-Tencor
Defect inspection is integral to the development and manufacture of semiconductor devices. This session will feature papers describing new ways to utilize e-beam and bare wafer inspection data while leveraging complementary defect inspection techniques.
Session 15 - Advanced Equipment and Materials II
Chairs: Holly Magoon, Nikon; Scott Lantz, Intel Corporation
Advanced memory, analog and logic manufacturers face daunting challenges as the next generation device nodes come on line. These challenges are bei ng met by the development and applications of innovations in equipment, materials, and processes. This session will focus on and will highlight some of the latest innovations that are being implemented in leading edge high volume manufacturing.
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